Substrate plating apparatus including hybrid paddle that simultaneously circulates and stirs plating solution and removes air bubbles

Abstract

Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

What is claimed is: 
     
         1 . A plating apparatus for a substrate, which plates a substrate, comprising:
 a plating bath configured to accommodate a plating solution; and   a hybrid paddle disposed in front of the substrate in the plating bath to stir the plating solution,   wherein the hybrid paddle comprises a spray assembly configured to spray the plating solution toward the substrate and a suction assembly configured to suction air bubbles formed on the substrate during plating, and   the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.   
     
     
         2 . The plating apparatus of  claim 1 , wherein the spray assembly comprises: a plurality of spray tubes spaced in parallel to each other to spray the plating solution; and a supply tube connected to one end of each of the plurality of spray tubes to transfer the plating solution, and
 the suction assembly comprises: a plurality of suction tubes arranged alternately with the plurality of spray tubes to suction the air bubbles; and a discharge tube connected to one end of each of the plurality of suction tubes to transfer the air bubbles.   
     
     
         3 . The plating apparatus of  claim 2 , wherein each of the spray tubes sprays the plating solution through a plurality of spray nozzles formed toward the substrate, and
 each of the suction tubes suctions the air bubbles through a plurality of suction holes formed toward the substrate.   
     
     
         4 . The plating apparatus of  claim 1 , further comprising a pump and a venturi tube, which circulate the plating solution and supply the plating solution to the hybrid paddle,
 wherein the pump collects the plating solution accommodated in the plating bath and discharges the collected plating solution to the venturi tube,   the venturi tube supplies the plating solution discharged from the pump to the spray assembly, and   
       an acceleration section in which a flow velocity in the venturi tube is accelerated is connected to the suction assembly through a circulation flow path to provide a suction force to the suction assembly.