Inventor · disambiguated record
Woon-Seong Kwon
Also filed as: KWON WOON-SEONG
58 granted patents·12 pending applications·437 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
70 records- 0197US10025047B1Integration of silicon photonics IC for high data rateGOOGLE INC·Filed 2017·Granted Jul 17, 2018·39 cites·14 claims
- 0297US9418966B1Semiconductor assembly having bridge module for die-to-die interconnectionXILINX INC·Filed 2015·Granted Aug 16, 2016·28 cites·12 claims
- 0397US9224697B1Multi-die integrated circuits implemented using spacer diesXILINX INC·Filed 2013·Granted Dec 29, 2015·55 cites·16 claims
- 0497US8946884B2Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) productXILINX INC·Filed 2013·Granted Feb 3, 2015·34 cites·23 claims
- 0596US10548240B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2019·Granted Jan 28, 2020·24 cites·20 claims
- 0696US9006030B1Warpage management for fan-out mold packaged integrated circuitXILINX INC·Filed 2013·Granted Apr 14, 2015·47 cites·16 claims
- 0795US7948555B2Camera module and electronic apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 24, 2011·32 cites·17 claims
- 0894US11832396B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2020·Granted Nov 28, 2023·3 cites·22 claims
- 0994US11600548B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted Mar 7, 2023·4 cites·20 claims
- 1094US10548239B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jan 28, 2020·12 cites·22 claims
- 1193US9627329B1Interposer with edge reinforcement and method for manufacturing sameXILINX INC·Filed 2014·Granted Apr 18, 2017·16 cites·17 claims
- 1293US8618648B1Methods for flip chip stackingKWON WOON-SEONG·Filed 2012·Granted Dec 31, 2013·22 cites·18 claims
- 1392US9245865B1Integrated circuit package with multi-trench structure on flipped substrate contacting underfillXILINX INC·Filed 2014·Granted Jan 26, 2016·14 cites·20 claims
- 1492US9147661B1Solder bump structure with enhanced high temperature aging reliability and method for manufacturing sameXILINX INC·Filed 2014·Granted Sep 29, 2015·15 cites·20 claims
- 1590US10681846B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jun 9, 2020·5 cites·28 claims
- 1690US10083920B1Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Sep 25, 2018·6 cites·20 claims
- 1790US2025349802A1Backside Integrated Voltage Regulator For Integrated CircuitsGOOGLE LLC·Filed 2025·Application pending·0 cites
- 1889US7786581B2Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 31, 2010·16 cites·10 claims
- 1988US12278217B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2024·Granted Apr 15, 2025·0 cites·15 claims
- 2088US11276668B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2020·Granted Mar 15, 2022·2 cites·20 claims
- 2188US7619315B2Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 17, 2009·14 cites·11 claims
- 2287US12308543B2Structure for optimal XPU socket compressionGOOGLE LLC·Filed 2022·Granted May 20, 2025·1 cites·19 claims
- 2387US11784215B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2020·Granted Oct 10, 2023·2 cites·21 claims
- 2486US12327817B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2024·Granted Jun 10, 2025·0 cites·18 claims
- 2586US10257921B1Embedded air gap transmission linesGOOGLE LLC·Filed 2018·Granted Apr 9, 2019·5 cites·18 claims
- 2685US7893514B2Image sensor package, method of manufacturing the same, and image sensor module including the image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 22, 2011·14 cites·13 claims
- 2784US11990386B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted May 21, 2024·1 cites·18 claims
- 2884US2025264677A1Asic Package With Photonics And Vertical Power DeliveryGOOGLE LLC·Filed 2025·Application pending·0 cites
- 2983US12394756B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2023·Granted Aug 19, 2025·0 cites·9 claims
- 3083US12315860B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 3183US12243802B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2024·Granted Mar 4, 2025·0 cites·7 claims
- 3282US9966345B1Protective barrier for integrated circuit packages housing a voltage regulator and a loadGOOGLE INC·Filed 2017·Granted May 8, 2018·4 cites·20 claims
- 3381US10658322B2High bandwidth memory package for high performance processorsGOOGLE LLC·Filed 2019·Granted May 19, 2020·2 cites·9 claims
- 3478US9831104B1Techniques for molded underfill for integrated circuit diesXILINX INC·Filed 2015·Granted Nov 28, 2017·3 cites·13 claims
- 3576US12278160B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
- 3676US11990461B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 3776US11978721B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 3876US11830855B2Backside integrated voltage regulator for integrated circuitsGOOGLE LLC·Filed 2022·Granted Nov 28, 2023·0 cites·10 claims
- 3975US12274079B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2023·Granted Apr 8, 2025·0 cites·23 claims
- 4074US8603917B2Method of processing a waferKWON WOON SEONG·Filed 2011·Granted Dec 10, 2013·3 cites·18 claims
- 4170US11488944B2Integrated circuit package for high bandwidth memoryGOOGLE LLC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 4270US10515920B2High bandwidth memory package for high performance processorsGOOGLE LLC·Filed 2018·Granted Dec 24, 2019·1 cites·10 claims
- 4370US10468359B2Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Nov 5, 2019·1 cites·18 claims
- 4469US12476227B2Socket to support high performance multi-die ASICsGOOGLE LLC·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 4568US11967538B2Three dimensional IC package with thermal enhancementGOOGLE LLC·Filed 2021·Granted Apr 23, 2024·0 cites·17 claims
- 4667US9508563B2Methods for flip chip stackingKWON WOON-SEONG·Filed 2012·Granted Nov 29, 2016·2 cites·20 claims
- 4766US11264295B2Integrated circuit substrate for containing liquid adhesive bleed-outGOOGLE LLC·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 4865US8114701B2Camera modules and methods of fabricating the sameKWON WOON-SEONG·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 4964US11264358B2ASIC package with photonics and vertical power deliveryGOOGLE LLC·Filed 2019·Granted Mar 1, 2022·0 cites·18 claims
- 5063US10643913B2Apparatus and mechanisms for reducing warpage and increasing surface mount technology yields in high performance integrated circuit packagesGOOGLE LLC·Filed 2018·Granted May 5, 2020·1 cites·18 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →