Inventor · disambiguated record
Woong Sun Lee
Also filed as: LEE WOONG SUN
12 granted patents·6 pending applications·89 citations·filing 1998–2013
88Inventor score
Files withLEE WOONG SUN6HYNIX SEMICONDUCTOR INC4KOREA ADVANCED INST SCI & TECH2SK HYNIX INC2BAE HAN JUN1
Top patents by PatentIndex Score
18 records- 0196US8053879B2Stacked semiconductor package and method for fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Nov 8, 2011·53 cites·5 claims
- 0281US7880093B23-dimensional substrate for embodying multi-packages and method of fabricating the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Feb 1, 2011·11 cites·25 claims
- 0374US8441116B2Semiconductor package having substrate for high speed semiconductor packageLEE WOONG SUN·Filed 2012·Granted May 14, 2013·4 cites·17 claims
- 0473US7387910B2Method of bonding solder pads of flip-chip packageKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Jun 17, 2008·6 cites·9 claims
- 0560US8399998B2Semiconductor package requiring reduced manufacturing processesKIM KI YOUNG·Filed 2009·Granted Mar 19, 2013·2 cites·15 claims
- 0659US7859108B2Flip chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 28, 2010·1 cites·19 claims
- 0751US8129627B2Circuit board having semiconductor chipLEE WOONG SUN·Filed 2009·Granted Mar 6, 2012·0 cites·20 claims
- 0851US2013236993A1Method of fabricating semiconductor packageSK HYNIX INC·Filed 2013·Application pending·0 cites
- 0949US6110276AMethod for making n-type semiconductor diamondKOREA ADVANCED INST SCI & TECH·Filed 1998·Granted Aug 29, 2000·12 cites·14 claims
- 1048US8445322B2Method of fabricating semiconductor packageLEE WOONG SUN·Filed 2011·Granted May 21, 2013·0 cites·20 claims
- 1147US2009174073A1Substrate for semiconductor package having coating film and method for manufacturing the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 1247US2009152708A1Substrate for high speed semiconductor package and semiconductor package having the sameLEE WOONG SUN·Filed 2008·Application pending·0 cites
- 1347US2013029458A1Substrate for semiconductor package having coating film and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
- 1443US8618637B2Semiconductor package using through-electrodes having voidsBAE HAN JUN·Filed 2008·Granted Dec 31, 2013·0 cites·16 claims
- 1541US2010142118A1Copper-clad laminate with capacitor, printed circuit board having the same, and semiconductor package having the printed circuit boardLEE WOONG SUN·Filed 2009·Application pending·0 cites
- 1640US8558380B2Stack package and method for manufacturing the sameKIM SI HAN·Filed 2012·Granted Oct 15, 2013·0 cites·12 claims
- 1740US2014014958A1Semiconductor chip module and semiconductor package having the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 1839US8796834B2Stack type semiconductor packageBAE JIN HO·Filed 2011·Granted Aug 5, 2014·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Woong Sun Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →