Inventor · disambiguated record

Wonsun Shin

Also filed as: SHIN WONSUN

6 granted patents·614 citations·filing 2000–2004

88Inventor score

Technology areasH10W

Files withAMKOR TECHNOLOGY INC6

Top patents by PatentIndex Score

6 records

0198US6395578B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·346 cites·35 claims
0296US6762078B2Semiconductor package having semiconductor chip within central aperture of substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·141 cites·15 claims
0389US6501184B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 31, 2002·58 cites·22 claims
0485US7061120B2Stackable semiconductor package having semiconductor chip within central through hole of substrateAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·33 cites·7 claims
0575US6830955B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·20 cites·12 claims
0666US6512288B1Circuit board semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·16 cites·18 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →