Inventor · disambiguated record

Won Dai Shin

Also filed as: SHIN WON DAI

3 granted patents·139 citations·filing 2000–2005

76Inventor score

Technology areasH10W

Files withAMKOR TECHNOLOGY INC3

Top patents by PatentIndex Score

3 records

0191US6841414B1Saw and etch singulation method for a chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·87 cites·16 claims
0286US7214326B1Increased capacity leadframe and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2005·Granted May 8, 2007·17 cites·20 claims
0379US6469258B1Circuit board for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·35 cites·44 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →