Inventor · disambiguated record
Wookyung You
Also filed as: YOU WOOKYUNG
31 granted patents·7 pending applications·111 citations·filing 2014–2024
95Inventor score
Top patents by PatentIndex Score
38 records- 0196US9953924B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 24, 2018·10 cites·20 claims
- 0296US9711453B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 18, 2017·12 cites·20 claims
- 0396US9368362B2Semiconductor devices including a capping layer and methods of forming semiconductor devices including a capping layerRHA SANGHO·Filed 2014·Granted Jun 14, 2016·42 cites·20 claims
- 0494US10269712B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 0593US11424182B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·3 cites·20 claims
- 0689US9929099B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·7 cites·15 claims
- 0789US9842803B2Semiconductor devices including gaps between conductive patternsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 12, 2017·5 cites·20 claims
- 0888US9524937B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 20, 2016·7 cites·20 claims
- 0987US11764149B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·20 claims
- 1086US11139244B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 5, 2021·2 cites·20 claims
- 1185US11776906B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 1281US10192782B2Method of manufacturing semiconductor device using a plurality of etch stop layersLEE WOOJIN·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 1380US9343409B2Semiconductor devices having staggered air gapsRHA SANGHO·Filed 2015·Granted May 17, 2016·3 cites·17 claims
- 1479US9972528B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 15, 2018·3 cites·20 claims
- 1577US9520300B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·2 cites·20 claims
- 1676US12014980B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1775US11133249B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·20 claims
- 1871US9799606B2Semiconductor device and method of fabricating the sameAHN SANG HOON·Filed 2015·Granted Oct 24, 2017·2 cites·14 claims
- 1965US10707164B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 7, 2020·0 cites·19 claims
- 2059US2024312903A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US11948883B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 2257US10497647B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·20 claims
- 2357US10141258B2Semiconductor devices having staggered air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·11 claims
- 2457US2024085812A1Substrate processing apparatus, substrate processing system, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2556US2024234253A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2654US9748170B2Semiconductor devices having staggered air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 29, 2017·0 cites·14 claims
- 2754US2024234250A9Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2853US9911644B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 6, 2018·0 cites·12 claims
- 2953US2024258204A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3052US2024145345A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3151US12341097B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·19 claims
- 3251US11646263B2Semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 9, 2023·0 cites·15 claims
- 3350US10186485B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 22, 2019·0 cites·20 claims
- 3450US9558994B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 31, 2017·0 cites·7 claims
- 3550US9406553B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·13 claims
- 3649US2024096797A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3738US10090381B2Semiconductor device including air-gapSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·20 claims
- 3837US10875091B2Metal powder, feedstock, and preparation method thereforIUCF HYU ERICA CAMPUS·Filed 2015·Granted Dec 29, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →