Inventor · disambiguated record

Wushing Yin

Also filed as: YIN WUSHING

1 granted patent·1 pending application·51 citations·filing 2001–2003

49Inventor score

Technology areasH05K Y10T

Files withINDIUM CORP AMERICA2

Top patents by PatentIndex Score

2 records

0186US6610559B2Integrated void-free process for assembling a solder bumped chipINDIUM CORP AMERICA·Filed 2001·Granted Aug 26, 2003·51 cites·13 claims
0232US2005028361A1Integrated underfill process for bumped chip assemblyINDIUM CORP AMERICA·Filed 2003·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →