Assignee
INDIUM CORP AMERICA
US·22 granted patents·3 pending applications·507 citations·filing 1985–2008
Top patents by PatentIndex Score
25 records- 0196US5256370ALead-free alloy containing tin, silver and indiumINDIUM CORP AMERICA·Filed 1992·Granted Oct 26, 1993·97 cites·13 claims
- 0286US7635076B2Method for fabricating large dimension bonds using reactive multilayer joiningINDIUM CORP AMERICA·Filed 2008·Granted Dec 22, 2009·7 cites·16 claims
- 0386US6610559B2Integrated void-free process for assembling a solder bumped chipINDIUM CORP AMERICA·Filed 2001·Granted Aug 26, 2003·51 cites·13 claims
- 0486US5580520ALead-free alloy containing tin, silver and indiumINDIUM CORP AMERICA·Filed 1994·Granted Dec 3, 1996·33 cites·17 claims
- 0586US5242658ALead-free alloy containing tin, zinc and indiumINDIUM CORP AMERICA·Filed 1992·Granted Sep 7, 1993·42 cites·28 claims
- 0685US7593228B2Technique for forming a thermally conductive interface with patterned metal foilINDIUM CORP AMERICA·Filed 2006·Granted Sep 22, 2009·29 cites·20 claims
- 0779US7017795B2Solder pastes for providing high elasticity, low rigidity solder jointsINDIUM CORP AMERICA·Filed 2004·Granted Mar 28, 2006·26 cites·19 claims
- 0879US5242097AIntegrated preformsINDIUM CORP AMERICA·Filed 1992·Granted Sep 7, 1993·48 cites·8 claims
- 0976US5455004ALead-free alloy containing tin, zinc, indium and bismuthINDIUM CORP AMERICA·Filed 1994·Granted Oct 3, 1995·25 cites·16 claims
- 1070US7749340B2Technique for increasing the compliance of lead-free solders containing silverINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·4 cites·28 claims
- 1164US7749336B2Technique for increasing the compliance of tin-indium soldersINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·2 cites·7 claims
- 1263US4620661ACorrosion resistant lid for semiconductor packageINDIUM CORP AMERICA·Filed 1985·Granted Nov 4, 1986·43 cites·8 claims
- 1362US5957364AIntegrated solder preform array having a tin outer coatingINDIUM CORP AMERICA·Filed 1996·Granted Sep 28, 1999·22 cites·1 claims
- 1460US6677179B2Method of applying no-flow underfillINDIUM CORP AMERICA·Filed 2001·Granted Jan 13, 2004·13 cites·13 claims
- 1551US4828608AProcess for ultrapurification of indiumINDIUM CORP AMERICA·Filed 1987·Granted May 9, 1989·10 cites·19 claims
- 1651US2007256761A1Alloy compositions and techniques for reducing intermetallic compound thickness and oxidation of metals and alloysINDIUM CORP AMERICA·Filed 2007·Application pending·0 cites
- 1749US5248476AFusible alloy containing bismuth, indium, lead, tin and galliumINDIUM CORP AMERICA·Filed 1992·Granted Sep 28, 1993·11 cites·7 claims
- 1845US4750665AMethod of producing a combination coverINDIUM CORP AMERICA·Filed 1986·Granted Jun 14, 1988·18 cites·5 claims
- 1943US2007071634A1Low melting temperature compliant soldersINDIUM CORP AMERICA·Filed 2006·Application pending·0 cites
- 2040US6059900ALead-based solders for high temperature applicationsINDIUM CORP AMERICA·Filed 1998·Granted May 9, 2000·7 cites·6 claims
- 2139US5600102ASolder preform wrappable around a printed circuit card edgeINDIUM CORP AMERICA·Filed 1996·Granted Feb 4, 1997·9 cites·10 claims
- 2238US4968550AWire braid reinforced indiumINDIUM CORP AMERICA·Filed 1989·Granted Nov 6, 1990·6 cites·5 claims
- 2335US6783057B2Anti-tombstoning solder alloys for surface mount applicationsINDIUM CORP AMERICA·Filed 2001·Granted Aug 31, 2004·0 cites·2 claims
- 2433US5108497ATreatment of indium dustsINDIUM CORP AMERICA·Filed 1990·Granted Apr 28, 1992·4 cites·10 claims
- 2532US2005028361A1Integrated underfill process for bumped chip assemblyINDIUM CORP AMERICA·Filed 2003·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →