Inventor · disambiguated record
Xavier Francois Brun
Also filed as: BRUN XAVIER · BRUN XAVIER F · BRUN XAVIER FRANCOIS
30 granted patents·51 pending applications·26 citations·filing 2011–2025
94Inventor score
Top patents by PatentIndex Score
81 records- 0197US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0296US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0395US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0487US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0586US12347782B2Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·16 claims
- 0686US11756860B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2019·Granted Sep 12, 2023·3 cites·25 claims
- 0784US12341080B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 0884US9437468B2Heat assisted handling of highly warped substrates post temporary bondingINTEL CORP·Filed 2014·Granted Sep 6, 2016·6 cites·20 claims
- 0984US2025293117A1Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2025·Application pending·0 cites
- 1083US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 1179US11978689B2Semiconductor device stack-up with bulk substrate material to mitigate hot spotsINTEL CORP·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1278US9620404B1Stiffener tape for electronic assembly that includes wafer or panelINTEL CORP·Filed 2015·Granted Apr 11, 2017·3 cites·17 claims
- 1377US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 1474US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 1574US2025293170A1Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2025·Application pending·0 cites
- 1673US2025293121A1Low cost embedded integrated circuit diesINTEL CORP·Filed 2025·Application pending·0 cites
- 1773US2025118698A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1867US12368089B2Low cost embedded integrated circuit diesINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 1967US12066584B2Fast power on method for marine acquisition streamerSERCEL RECH CONST ELECT·Filed 2022·Granted Aug 20, 2024·0 cites·11 claims
- 2067US9919509B2Peeling device, peeling system and peeling methodHIRAKAWA OSAMU·Filed 2011·Granted Mar 20, 2018·2 cites·17 claims
- 2166US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 2266US8969134B2Laser ablation tape for solder interconnect formationINTEL CORP·Filed 2013·Granted Mar 3, 2015·2 cites·20 claims
- 2364US12444672B2Hybrid bonding technologies with thermal expansion compensation structuresINTEL CORP·Filed 2022·Granted Oct 14, 2025·0 cites·19 claims
- 2459US2025210392A1Handling assembly, handling system and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 2559US2023088170A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2021·Application pending·0 cites
- 2659US2025309192A13d die stacking with hybrid bonding and through dielectric via structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2758US2025112181A1Bonding structures having non-vertical edges for self-alignment assisted assembly of integrated circuit die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 2858US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 2958US2025006643A1Methods of forming wafer level multi-die system fabric interconnect structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 3058US2025112177A1Self-alignment assisted assembly on a structural wafer for hybrid bonded die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 3157US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2024429199A1Methods and apparatus for self-aligning batch pick and place die bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 3354US12021016B2Thermally enhanced silicon back end layers for improved thermal performanceINTEL CORP·Filed 2020·Granted Jun 25, 2024·0 cites·16 claims
- 3453US9793151B2Stiffener tape for electronic assemblyINTEL CORP·Filed 2014·Granted Oct 17, 2017·0 cites·16 claims
- 3553US2024113073A1Side of a die that is coplanar with a side of a moldingINTEL CORP·Filed 2022·Application pending·0 cites
- 3653US2025210398A1Patternable bond-debond processes and apparatusesINTEL CORP·Filed 2023·Application pending·0 cites
- 3752US11480699B2Fast power on method for marine acquisition streamerSERCEL RECH CONST ELECT·Filed 2019·Granted Oct 25, 2022·0 cites·11 claims
- 3852US2024063179A1Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 3952US2025309143A1Hermetic layer above a die and mold material within a packageINTEL CORP·Filed 2024·Application pending·0 cites
- 4052US2024063071A1Inorganic material deposition for inter-die fill in multi-chip composite structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 4152US2025006678A1Packaging architecture for wafer-scale known-good-die hybrid bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 4252US2024395567A1Selective underfilling using pre-applied thermoset adhesiveINTEL CORP·Filed 2023·Application pending·0 cites
- 4351US12080620B2Additively manufactured structures for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 4451US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 4551US2024153837A1Barrier enabled cuf and mold process for multi-chip packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 4651US2024413031A1On die flexure control device and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 4751US2025284079A1Multi-coupler architectures for optical co-packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 4851US2024347501A1Methods and apparatus for die-shape modification bondingNIAZI HARIS KHAN·Filed 2024·Application pending·0 cites
- 4951US2024063136A1Integrated circuit device with electrically active fiducialsINTEL CORP·Filed 2022·Application pending·0 cites
- 5051US2023207475A1Hybrid bonded stacked memory with tsv as chiplet for package structureINTEL CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →