Inventor · disambiguated record
Xaver Schloegel
Also filed as: SCHLOEGEL XAVER
59 granted patents·9 pending applications·296 citations·filing 1995–2022
98Inventor score
Files withINFINEON TECHNOLOGIES AG29INFINEON TECHNOLOGIES AUSTRIA AG16OTREMBA RALF13INFINEON TECHNOLOGIES AUSTRIA7HOEGLAUER JOSEF1
Top patents by PatentIndex Score
68 records- 0195US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 0291US7732929B2Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 8, 2010·23 cites·15 claims
- 0390US7969018B2Stacked semiconductor chips with separate encapsulationsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·22 cites·20 claims
- 0490US7759777B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 20, 2010·20 cites·7 claims
- 0589US8030131B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 4, 2011·17 cites·13 claims
- 0689US7851908B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·19 cites·17 claims
- 0787US9515060B2Multi-chip semiconductor power deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2013·Granted Dec 6, 2016·7 cites·16 claims
- 0885US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 0985US7626262B2Electrically conductive connection, electronic component and method for their productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 1, 2009·13 cites·12 claims
- 1084US8410592B2Semiconductor device and method for producing the sameOTREMBA RALF·Filed 2007·Granted Apr 2, 2013·12 cites·32 claims
- 1181US8975117B2Semiconductor device using diffusion solderingOTREMBA RALF·Filed 2012·Granted Mar 10, 2015·7 cites·15 claims
- 1281US7728415B2Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·10 cites·14 claims
- 1380US11676881B2Semiconductor package, semiconductor assembly and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·1 cites·20 claims
- 1479US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 1579US7727813B2Method for making a device including placing a semiconductor chip on a substrateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·9 cites·10 claims
- 1678US9147631B2Semiconductor power device having a heat sinkINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Sep 29, 2015·4 cites·18 claims
- 1777US9397018B2Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuitINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 19, 2016·4 cites·17 claims
- 1877US8637341B2Semiconductor moduleOTREMBA RALF·Filed 2008·Granted Jan 28, 2014·7 cites·16 claims
- 1977US8237268B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2007·Granted Aug 7, 2012·6 cites·29 claims
- 2076US8334586B2Stacked semiconductor chips with separate encapsulationsOTREMBA RALF·Filed 2011·Granted Dec 18, 2012·4 cites·19 claims
- 2174US8115294B2Multichip module with improved system carrierOTREMBA RALF·Filed 2007·Granted Feb 14, 2012·6 cites·18 claims
- 2274US7629676B2Semiconductor component having a semiconductor die and a leadframeINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·6 cites·14 claims
- 2372US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 2472US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 2572US9123526B2Module comprising a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 1, 2015·2 cites·17 claims
- 2672US8643176B2Power semiconductor chip having two metal layers on one faceOTREMBA RALF·Filed 2011·Granted Feb 4, 2014·3 cites·24 claims
- 2771US8093713B2Module with silicon-based layerOTREMBA RALF·Filed 2007·Granted Jan 10, 2012·4 cites·25 claims
- 2870US10833583B2Methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 2970US8896106B2Semiconductor packages having multiple lead frames and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 3070US7923827B2Semiconductor module for a switched-mode power supply and method for its assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 12, 2011·6 cites·23 claims
- 3169US10886186B2Semiconductor package systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·24 claims
- 3269US9184066B2Chip arrangements and methods for manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 10, 2015·2 cites·33 claims
- 3369US7589413B2Semiconductor device comprising a vertical semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 15, 2009·4 cites·29 claims
- 3467US9099441B2Power transistor arrangement and method for manufacturing the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 4, 2015·2 cites·15 claims
- 3566US9230880B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 5, 2016·1 cites·20 claims
- 3665US8987880B2Chip module and a method for manufacturing a chip moduleHOEGLAUER JOSEF·Filed 2012·Granted Mar 24, 2015·2 cites·12 claims
- 3763US9362240B2Electronic deviceINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jun 7, 2016·1 cites·14 claims
- 3862US9147628B2Package-in-packages and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Sep 29, 2015·1 cites·17 claims
- 3962US8853849B2Package arrangement and a method of manufacturing a package arrangementINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 7, 2014·1 cites·15 claims
- 4061US9263440B2Power transistor arrangement and package having the sameINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Feb 16, 2016·1 cites·18 claims
- 4159US7667326B2Power semiconductor component, power semiconductor device as well as methods for their productionINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 23, 2010·1 cites·32 claims
- 4258US10903133B2Method of producing an SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jan 26, 2021·0 cites·19 claims
- 4358US10601314B2Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modulesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Mar 24, 2020·0 cites·13 claims
- 4458US2020083207A1Method of Manufacturing a Multi-Chip Semiconductor Power DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Application pending·0 cites
- 4556US9449902B2Semiconductor packages having multiple lead frames and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·27 claims
- 4652US9379046B2Module comprising a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 28, 2016·0 cites·19 claims
- 4752US8633102B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2012·Granted Jan 21, 2014·0 cites·20 claims
- 4851US2017047315A1Method of Manufacturing a Multi-Chip Semiconductor Power DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Application pending·0 cites
- 4950US9117786B2Chip module, an insulation material and a method for fabricating a chip moduleINFINEON TECHNOLOGIES AG·Filed 2012·Granted Aug 25, 2015·0 cites·17 claims
- 5050US8697497B2Module with silicon-based layerOTREMBA RALF·Filed 2011·Granted Apr 15, 2014·0 cites·9 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Xaver Schloegel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →