Inventor · disambiguated record
Xiancan Deng
Also filed as: DENG XIANCAN
4 granted patents·99 citations·filing 1997–2001
80Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC4
Top patents by PatentIndex Score
4 records- 0181US6547978B2Method of heating a semiconductor substrateAPPLIED MATERIALS INC·Filed 2001·Granted Apr 15, 2003·26 cites·18 claims
- 0279US6008140ACopper etch using HCI and HBr chemistryAPPLIED MATERIALS INC·Filed 1997·Granted Dec 28, 1999·47 cites·8 claims
- 0375US6534416B1Control of patterned etching in semiconductor featuresAPPLIED MATERIALS INC·Filed 2000·Granted Mar 18, 2003·15 cites·7 claims
- 0448US6489247B1Copper etch using HCl and HBR chemistryAPPLIED MATERIALS INC·Filed 1999·Granted Dec 3, 2002·11 cites·42 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →