Inventor · disambiguated record
Xia Feng
Also filed as: FENG XIA · Feng xia-ting
36 granted patents·3 pending applications·201 citations·filing 2010–2023
97Inventor score
Files withSTATS CHIPPAC LTD12BOE TECHNOLOGY GROUP CO LTD8LIN YAOJIAN8UNIV NORTHEASTERN3SEMICONDUCTOR MFG INT SHANGHAI CORP2
Top patents by PatentIndex Score
39 records- 0198US9679863B2Semiconductor device and method of forming interconnect substrate for FO-WLCSPLIN YAOJIAN·Filed 2011·Granted Jun 13, 2017·59 cites·5 claims
- 0297US9548240B2Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor packageSTATS CHIPPAC LTD·Filed 2015·Granted Jan 17, 2017·20 cites·25 claims
- 0396US8343809B2Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor dieSTATS CHIPPAC LTD·Filed 2010·Granted Jan 1, 2013·23 cites·27 claims
- 0494US8907476B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2012·Granted Dec 9, 2014·12 cites·24 claims
- 0594US8786100B2Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Jul 22, 2014·14 cites·25 claims
- 0694US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 0793US8409926B2Semiconductor device and method of forming insulating layer around semiconductor dieLIN YAOJIAN·Filed 2010·Granted Apr 2, 2013·12 cites·24 claims
- 0892US10365193B2Test apparatus and method for determining time-dependence failure under constant temperature through high pressure true triaxial loading for hard rockUNIV NORTHEASTERN·Filed 2017·Granted Jul 30, 2019·8 cites·9 claims
- 0989US10324014B2Low-frequency disturbance and high-speed impact type high-pressure true triaxial test apparatus and methodUNIV NORTHEASTERN·Filed 2017·Granted Jun 18, 2019·6 cites·5 claims
- 1083US8183095B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationLIN YAOJIAN·Filed 2011·Granted May 22, 2012·4 cites·20 claims
- 1182US9666500B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2015·Granted May 30, 2017·2 cites·22 claims
- 1281US10428654B2Cutter head for microwave presplitting type hard-rock tunnel boring machineUNIV NORTHEASTERN·Filed 2017·Granted Oct 1, 2019·8 cites·8 claims
- 1381US9542898B2Driving method of a liquid crystal display panel, a liquid crystal display panel and a display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2014·Granted Jan 10, 2017·3 cites·15 claims
- 1478US9558958B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationSTATS CHIPPAC LTD·Filed 2014·Granted Jan 31, 2017·2 cites·25 claims
- 1577US9754867B2Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Sep 5, 2017·2 cites·25 claims
- 1677US8759155B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2013·Granted Jun 24, 2014·2 cites·24 claims
- 1774US9472452B2Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor dieSTATS CHIPPAC LTD·Filed 2014·Granted Oct 18, 2016·2 cites·25 claims
- 1874US8501618B2Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axisLIN YAOJIAN·Filed 2011·Granted Aug 6, 2013·3 cites·25 claims
- 1969US9626922B2GOA circuit, array substrate, display device and driving methodBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Apr 18, 2017·1 cites·2 claims
- 2066US8962476B2Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axisSTATS CHIPPAC LTD·Filed 2013·Granted Feb 24, 2015·2 cites·25 claims
- 2164US10163815B2Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layerSTATS CHIPPAC LTD·Filed 2013·Granted Dec 25, 2018·1 cites·12 claims
- 2263US10304398B2Driver integrated circuit for driving display panel, display device and method for driving driver integrated circuit capable of providing different current intensities to different length transmission wiresBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted May 28, 2019·1 cites·15 claims
- 2363US8642446B2Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layerLIN YAOJIAN·Filed 2010·Granted Feb 4, 2014·1 cites·26 claims
- 2460US9437552B2Semiconductor device and method of forming insulating layer around semiconductor dieSTATS CHIPPAC LTD·Filed 2014·Granted Sep 6, 2016·0 cites·17 claims
- 2560US9269313B2GOA circuit, array substrate, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2013·Granted Feb 23, 2016·0 cites·14 claims
- 2660US9087930B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2014·Granted Jul 21, 2015·0 cites·25 claims
- 2759US12493152B2Optical device and fabrication method thereofSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2023·Granted Dec 9, 2025·0 cites·8 claims
- 2859US10204866B2Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulationSTATS CHIPPAC PTE LTD·Filed 2016·Granted Feb 12, 2019·0 cites·24 claims
- 2956US8878359B2Semiconductor device and method of forming insulating layer around semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Nov 4, 2014·0 cites·30 claims
- 3054US10580379B2Display panel and driving method therefor, and display apparatusBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Mar 3, 2020·0 cites·19 claims
- 3152US11921318B2Semiconductor structure and method of forming the sameSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2022·Granted Mar 5, 2024·0 cites·19 claims
- 3252US10607946B2Semiconductor device and method of forming interconnect substrate for FO-WLCSPJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Mar 31, 2020·0 cites·17 claims
- 3350US10359160B2Light emitting device for a containerFENG XIA·Filed 2017·Granted Jul 23, 2019·0 cites·3 claims
- 3447US2015279524A1Gamma resistor adjusting device, driving circuit and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2013·Application pending·0 cites
- 3543US9202713B2Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitchLIN YAOJIAN·Filed 2011·Granted Dec 1, 2015·0 cites·30 claims
- 3642US10739415B2Printed circuit board and detection method for detecting connection between printed circuit board and flexible circuit board, and display panelBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Aug 11, 2020·0 cites·10 claims
- 3742US2015056247A1Sequential and repeated immunization with four or more vector-based HIV gene vaccinesZENG YI·Filed 2011·Application pending·0 cites
- 3840US9368538B2Image sensor device and method of manufacturing the sameSEMICONDUCTOR MFG INT SHANGHAI·Filed 2015·Granted Jun 14, 2016·0 cites·19 claims
- 3937US2016314755A1Regulating system, regulating method, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →