Inventor · disambiguated record
Xian-Qin Hu
Also filed as: HU XIAN · Hu xian-qin
42 granted patents·13 pending applications·42 citations·filing 2013–2022
95Inventor score
Files withAVARY HOLDING SHENZHEN CO LTD18HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD10FUKUI PREC COMPONENT SHENZHEN9FUKUI PREC COMPONENT (SHENZHEN) CO LTD8QING DING PREC ELECTRONICS HUAIAN CO LTD5
Top patents by PatentIndex Score
55 records- 0196US11197368B1High-frequency circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 7, 2021·4 cites·6 claims
- 0294US9485859B1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Nov 1, 2016·17 cites·20 claims
- 0390US10681824B1Waterproof circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 9, 2020·8 cites·19 claims
- 0478US10205487B1Wireless power consortium device and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 0578US9066431B2Method for manufacturing printed circuit board with patterned electrically conductive layer therein visibleFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Jun 23, 2015·4 cites·8 claims
- 0677US12063750B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·9 claims
- 0774US10104771B1Method for making a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 0872US11700685B2Method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 0972US10321561B2Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jun 11, 2019·1 cites·11 claims
- 1071US11665833B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 1169US11979977B2Circuit board with heat dissipation structure and method for manufacturing sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted May 7, 2024·1 cites·14 claims
- 1269US9992858B2Printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted Jun 5, 2018·1 cites·4 claims
- 1368US11523517B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·8 claims
- 1468US11294285B2Method for manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·9 claims
- 1566US9277640B2Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted Mar 1, 2016·1 cites·8 claims
- 1665US10533811B2Heat dissipation deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·15 claims
- 1765US9706640B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Jul 11, 2017·1 cites·9 claims
- 1864US9615445B2Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Apr 4, 2017·1 cites·20 claims
- 1961US11212922B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·5 claims
- 2060US11140785B2Flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 2160US10791625B2Method for manufacturing flexible printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·9 claims
- 2259US10653015B2Multilayer circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted May 12, 2020·0 cites·7 claims
- 2358US10660218B2Method of manufacturing multilayer circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted May 19, 2020·0 cites·10 claims
- 2458US10012454B2Heat dissipation device and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 2557US10653011B2Method for manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2017·Granted May 12, 2020·0 cites·6 claims
- 2656US10638606B2Composite circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·6 claims
- 2756US9357631B2Flexible printed circuit board and method for making sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted May 31, 2016·0 cites·12 claims
- 2855US10542627B2Method for manufacturing a flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 2954US10365430B2Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained therebyAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·26 claims
- 3054US9820388B2Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2014·Granted Nov 14, 2017·0 cites·18 claims
- 3153US11417890B2Flexible battery assembly and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·16 claims
- 3252US10159149B2Composite circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·9 claims
- 3351US11532069B2Method for processing image, electronic equipment, and storage mediumXIAOMI TECHNOLOGY WUHAN CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3450US9288914B2Method of manufacturing a printed circuit board with circuit visibleFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Mar 15, 2016·0 cites·8 claims
- 3550US2015053466A1Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 3649US2014151092A1Pcb with visible circuit and method for making and using pcb with visible circuitZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 3748US11790692B2Method for behaviour recognition, electronic equipment, and storage mediumXIAOMI TECHNOLOGY WUHAN CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·14 claims
- 3847US11816924B2Method for behaviour recognition based on line-of-sight estimation, electronic equipment, and storage mediumXIAOMI TECHNOLOGY WUHAN CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·11 claims
- 3947US2022225510A1Circuit board and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 4046US2021392758A1Thin circuit board and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 4145US10278307B2Cooling plate and method for manufacturing thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·10 claims
- 4245US2021399397A1High-frequency signal transmission structureand method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Application pending·0 cites
- 4345US2015101785A1Heat dissipation device and a method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 4445US2015189760A1Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 4544US2021059058A1Multilayer circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 4642US11264701B1Method for manufacturing an antenna printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 4742US9622340B2Flexible circuit board and method for manufacturing sameHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2015·Granted Apr 11, 2017·0 cites·20 claims
- 4840US10285260B2Flexible printed circuit board and method for manufacturing sameAVARY HOLDING SHENZHEN CO LTD·Filed 2015·Granted May 7, 2019·0 cites·3 claims
- 4940US9693448B2Flexible circuit board and method for making the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 5040US2023199966A1Circuit board with embedded component and method of fabricating the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →