Inventor · disambiguated record
Xiaohong Jiang
Also filed as: JIANG XIAOHONG
33 granted patents·7 pending applications·177 citations·filing 1999–2024
96Inventor score
Files withUNITED MICROELECTRONICS CORP12ALTERA CORP9SHENZHEN YOUQING TECH CO LTD6JIANG XIAOHONG4CHARTERED SEMICONDUCTOR MFG3
Top patents by PatentIndex Score
40 records- 0195US9425149B1Integrated circuit package routing with reduced crosstalkALTERA CORP·Filed 2013·Granted Aug 23, 2016·26 cites·11 claims
- 0293USD930375SBike saddleSHENZHEN YOUQING TECH CO LTD·Filed 2021·Granted Sep 14, 2021·22 cites·1 claims
- 0392US9245835B1Integrated circuit package with reduced pad capacitanceALTERA CORP·Filed 2013·Granted Jan 26, 2016·15 cites·19 claims
- 0491US8368174B1Compensation network using an on-die compensation inductorALTERA CORP·Filed 2010·Granted Feb 5, 2013·12 cites·20 claims
- 0589US8294259B2Interconnect pattern for transceiver packageJIANG XIAOHONG·Filed 2010·Granted Oct 23, 2012·12 cites·16 claims
- 0688US11641000B2Image sensor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 2, 2023·2 cites·20 claims
- 0787US8841561B1High performance PCBJIANG XIAOHONG·Filed 2010·Granted Sep 23, 2014·9 cites·15 claims
- 0886USD974783SBike saddleSHENZHEN YOUQING TECH CO LTD·Filed 2021·Granted Jan 10, 2023·10 cites·1 claims
- 0986USD949584SBike saddleSHENZHEN YOUQING TECH CO LTD·Filed 2021·Granted Apr 26, 2022·11 cites·1 claims
- 1084US12176375B2Image sensor structure including nanowire structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 24, 2024·1 cites·10 claims
- 1183US9331370B1Multilayer integrated circuit packages with localized air structuresALTERA CORP·Filed 2013·Granted May 3, 2016·5 cites·18 claims
- 1282US8502386B2Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packagesJIANG XIAOHONG·Filed 2010·Granted Aug 6, 2013·6 cites·19 claims
- 1382US2024395834A1Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1478US12094896B2Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 17, 2024·0 cites·17 claims
- 1578US12080734B2Photosensitive semiconductor device including heterojunction photodiodeUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 3, 2024·0 cites·3 claims
- 1678US9842813B2Tranmission line bridge interconnectsALTERA CORP·Filed 2015·Granted Dec 12, 2017·3 cites·22 claims
- 1776USD1043152SRecliner chairSHENZHEN YOUQING TECH CO LTD·Filed 2024·Granted Sep 24, 2024·4 cites·1 claims
- 1876US2025022905A1Manufacturing method of image sensor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1972USD981121SBike saddleSHENZHEN YOUQING TECH CO LTD·Filed 2022·Granted Mar 21, 2023·4 cites·1 claims
- 2071USD974058SBike saddleSHENZHEN YOUQING TECH CO LTD·Filed 2022·Granted Jan 3, 2023·4 cites·1 claims
- 2169US7253483B2Semiconductor device layout and channeling implant processCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted Aug 7, 2007·2 cites·23 claims
- 2267US11527561B2Photosensitive semiconductor device including top surface photodiodeUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 13, 2022·0 cites·15 claims
- 2366US10909299B1Method for stabilizing bandgap voltageUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 2, 2021·0 cites·10 claims
- 2465US9401330B1IC package with non-uniform dielectric layer thicknessJIANG XIAOHONG·Filed 2009·Granted Jul 26, 2016·3 cites·10 claims
- 2563USD1077846SDisplay screen or portion thereof with graphical user interfaceLENOVO BEIJING LTD·Filed 2023·Granted Jun 3, 2025·2 cites·1 claims
- 2663US8723293B1Compensation network using an on-die compensation inductorALTERA CORP·Filed 2013·Granted May 13, 2014·1 cites·20 claims
- 2763US7752587B2Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packagesALTERA CORP·Filed 2007·Granted Jul 6, 2010·2 cites·23 claims
- 2860US6313999B1Self alignment device for ball grid array devicesAGERE SYST OPTOELECTRONICS·Filed 1999·Granted Nov 6, 2001·19 cites·20 claims
- 2957US2025366178A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3055US12433042B2Image sensor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 30, 2025·0 cites·28 claims
- 3154US2025031585A1Resistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3253US11101361B1Gate-all-around (GAA) transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 3351US7573099B2Semiconductor device layout and channeling implant processCHARTERED SEMICONDUCTOR MFG·Filed 2005·Granted Aug 11, 2009·0 cites·21 claims
- 3451US6972236B2Semiconductor device layout and channeling implant processCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Dec 6, 2005·2 cites·13 claims
- 3550US12057413B2Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and costINTEL CORP·Filed 2019·Granted Aug 6, 2024·0 cites·21 claims
- 3649US12190530B2Dense optical flow calculation system and method based on FPGAUNIV ZHEJIANG·Filed 2021·Granted Jan 7, 2025·0 cites·15 claims
- 3742US2014264783A1Apparatus for electronic assembly with improved interconnect and associated methodsALTERA CORP·Filed 2013·Application pending·0 cites
- 3841US9941201B1Magnetically decoupled inductor structuresALTERA CORP·Filed 2016·Granted Apr 10, 2018·0 cites·20 claims
- 3940US2022254493A1Chronic disease prediction system based on multi-task learning modelUNIV ZHEJIANG·Filed 2020·Application pending·0 cites
- 4039US2022319706A1A drgs automatic grouping method based on a convolutional neural networkUNIV ZHEJIANG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →