Inventor · disambiguated record
Xingzhi Liang
Also filed as: LIANG XINGZHI
1 granted patent·3 pending applications·6 citations·filing 2008–2012
30Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0173US8499813B2System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2012·Granted Aug 6, 2013·6 cites·20 claims
- 0236US2009321952A1Wire on wire stitch bonding in a semiconductor deviceLIANG XINGZHI·Filed 2008·Application pending·0 cites
- 0336US2009321501A1Method of fabricating wire on wire stitch bonding in a semiconductor deviceLIANG XINGZHI·Filed 2008·Application pending·0 cites
- 0433US2011084377A1System for separating a diced semiconductor die from a die attach tapeCHIEN JACK CHANG·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Xingzhi Liang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →