Inventor · disambiguated record
Xingsong Su
Also filed as: SU XINGSONG
18 granted patents·5 pending applications·1 citations·filing 2021–2023
85Inventor score
Files withCHANGXIN MEMORY TECH INC23
Top patents by PatentIndex Score
23 records- 0188US11854862B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 26, 2023·1 cites·7 claims
- 0264US12225707B2Method for manufacturing semiconductor structure, semiconductor structure and semiconductor memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 0361US12309998B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0460US12446212B2Semiconductor structure, method for manufacturing same and memoryCHANGXIN MEMORY TECH INC·Filed 2023·Granted Oct 14, 2025·0 cites·18 claims
- 0558US12426249B2Semiconductor structure and method for manufacturing same, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 0658US12295151B2Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted May 6, 2025·0 cites·10 claims
- 0757US12396182B2Capacitor and manufacturing method thereof, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 19, 2025·0 cites·6 claims
- 0857US12336162B2Memory, semiconductor structure and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0957US12225718B2Semiconductor structure and method for forming semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 11, 2025·0 cites·17 claims
- 1056US12446206B2Three-dimensional semiconductor structure and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 14, 2025·0 cites·14 claims
- 1156US12382624B22T0C semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Aug 5, 2025·0 cites·15 claims
- 1255US12356605B2Memory device and manufacturing method thereforCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 8, 2025·0 cites·17 claims
- 1353US12469697B2Preparation method for capacitor structure, capacitor structure, and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Nov 11, 2025·0 cites·17 claims
- 1453US12127415B2Manufacturing method for capacitor structure, capacitor structure and memoryCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 22, 2024·0 cites·14 claims
- 1553US12041763B2Method for forming capacitor, capacitor and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2022·Granted Jul 16, 2024·0 cites·16 claims
- 1652US12490420B2Semiconductor structure and manufacturing method therefor, and memoryCHANGXIN MEMORY TECH INC·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 1752US2023413523A1Semiconductor structure and method for forming semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2023·Application pending·0 cites
- 1850US12033799B2Capacitor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jul 9, 2024·0 cites·15 claims
- 1947US2022254874A1Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 2046US12211889B2Electrode layer, capacitor and methods for electrode layer and capacitor manufactureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jan 28, 2025·0 cites·13 claims
- 2145US2022271131A1Semiconductor structure and method for forming sameCHANGXIN MEMORY TECH INC·Filed 2022·Application pending·0 cites
- 2244US2022216140A1Integrated circuit capacitance device and method for manufacturing integrated circuit capacitance deviceCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 2342US2022181327A1Semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →