Inventor · disambiguated record
Xinke Wang
Also filed as: WANG XINKE
4 granted patents·11 pending applications·5 citations·filing 2013–2024
63Inventor score
Top patents by PatentIndex Score
15 records- 0193US11545354B2Molecular layer deposition method and systemAPPLIED MATERIALS INC·Filed 2020·Granted Jan 3, 2023·3 cites·20 claims
- 0287US11972940B2Area selective carbon-based film depositionAPPLIED MATERIALS INC·Filed 2022·Granted Apr 30, 2024·1 cites·7 claims
- 0371US2024234127A1Area selective carbon-based film depositionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0459US2025293017A1Methods of forming conformal silicon oxycarbonitride thin films on high aspect ratio semiconductor structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0559US2025299946A1Method for forming conformal silicon oxide thin filmAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0659US2024183035A1Area selective deposition through surface silylationAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0757US2024332014A1Doping by molecular layer depositionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0856US9228899B2Terahertz temporal and spatial resolution imaging system, imaging method and application thereofUNIV CAPITAL NORMAL·Filed 2013·Granted Jan 5, 2016·1 cites·40 claims
- 0956US2025125195A1Oligomer film for bottom-up gap fill processesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1055US2024371654A1Silicon nitride damage-free dry etch method for tungsten removal in middle of line bottom-up tungsten integrationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1153US11552265B2Resistance-switching polymer films and methods of manufactureAPPLIED MATERIALS INC·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1252US2024055255A1Selective deposition for sub 20 nm pitch euv patterningAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1352US2024105499A1Molecular layer deposition carbon masks for direct selective deposition of silicon-containing materialsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1451US2024027912A1Method to reduce line edge roughness for euv photoresist patternAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1551US2025201548A1Methods of depositing silicon-containing dielectric layers for semiconductor devicesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →