Inventor · disambiguated record
Xiaojie Xue
Also filed as: XUE XIAOJIE
12 granted patents·130 citations·filing 2009–2017
91Inventor score
Top patents by PatentIndex Score
12 records- 0193US8853839B2Air-release features in cavity packagesANALOG DEVICES INC·Filed 2012·Granted Oct 7, 2014·66 cites·53 claims
- 0291US9343367B2Integrated device die and package with stress reduction featuresANALOG DEVICES INC·Filed 2014·Granted May 17, 2016·11 cites·20 claims
- 0390US8836132B2Vertical mount package and wafer level packaging thereforXUE XIAOJIE·Filed 2012·Granted Sep 16, 2014·12 cites·37 claims
- 0489US8692366B2Apparatus and method for microelectromechanical systems device packagingXUE XIAOJIE·Filed 2011·Granted Apr 8, 2014·9 cites·34 claims
- 0587US8624380B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2012·Granted Jan 7, 2014·6 cites·11 claims
- 0686US9209121B2Double-sided packageANALOG DEVICES INC·Filed 2013·Granted Dec 8, 2015·8 cites·30 claims
- 0782US9698127B2Integrated device die and package with stress reduction featuresANALOG DEVICES INC·Filed 2016·Granted Jul 4, 2017·3 cites·20 claims
- 0880US9278851B2Vertical mount package and wafer level packaging thereforANALOG DEVICES INC·Filed 2014·Granted Mar 8, 2016·4 cites·37 claims
- 0975US10287161B2Stress isolation features for stacked diesANALOG DEVICES INC·Filed 2016·Granted May 14, 2019·3 cites·20 claims
- 1075US9728510B2Cavity package with composite substrateANALOG DEVICES INC·Filed 2015·Granted Aug 8, 2017·2 cites·20 claims
- 1175US8174111B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2009·Granted May 8, 2012·6 cites·11 claims
- 1253US10490510B2Cavity package with composite substrateANALOG DEVICES INC·Filed 2017·Granted Nov 26, 2019·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →