Inventor · disambiguated record
Xundong Dai
Also filed as: DAI XUNDONG
3 granted patents·2 pending applications·1 citations·filing 2019–2024
48Inventor score
Files withAPPLIED MATERIALS INC5
Top patents by PatentIndex Score
5 records- 0176US2025092559A1Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0266US12195867B2Electrochemical deposition systems with enhanced crystallization prevention featuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 14, 2025·0 cites·7 claims
- 0365US11309278B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 0455US12001193B2Apparatus for environmental control of dies and substrates for hybrid bondingAPPLIED MATERIALS INC·Filed 2022·Granted Jun 4, 2024·0 cites·19 claims
- 0550US2024136159A1Metallic Shield For Stable Tape-Frame Substrate ProcessingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Xundong Dai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →