Inventor · disambiguated record
Xuejiao Hu
Also filed as: HU XUEJIAO
10 granted patents·4 pending applications·40 citations·filing 2004–2025
86Inventor score
Files withINTEL CORP5HU XUEJIAO4BAOTOU RES INST RARE EARTHS1MOLECULAR NANOSYSTEMS INC1NANJING UNIVERSITY OF TECHNOLOGY1
Top patents by PatentIndex Score
14 records- 0177US8084856B2Thermal spacer for stacked die package thermal managementHU XUEJIAO·Filed 2010·Granted Dec 27, 2011·5 cites·18 claims
- 0272US7662501B2Transpiration cooling and fuel cell for ultra mobile applicationsINTEL CORP·Filed 2008·Granted Feb 16, 2010·2 cites·24 claims
- 0369US7723841B2Thermal spacer for stacked die package thermal managementINTEL CORP·Filed 2006·Granted May 25, 2010·4 cites·11 claims
- 0469US7463486B1Transpiration cooling for passive cooled ultra mobile personal computerINTEL CORP·Filed 2007·Granted Dec 9, 2008·5 cites·24 claims
- 0568US8054629B2Microfins for cooling an ultramobile deviceINTEL CORP·Filed 2008·Granted Nov 8, 2011·3 cites·12 claims
- 0667US8389119B2Composite thermal interface material including aligned nanofiber with low melting temperature binderPANZER MATTHEW·Filed 2007·Granted Mar 5, 2013·6 cites·2 claims
- 0766US8154728B2Analytical equipment enclosure incorporating phase changing materialsHU XUEJIAO·Filed 2008·Granted Apr 10, 2012·2 cites·21 claims
- 0863US2025360560A1Hydrogen decrepitation apparatuses and hydrogen recycling methodsBAOTOU RES INST RARE EARTHS·Filed 2025·Application pending·0 cites
- 0960US11339227B2Cyclodextrin polymer for fast absorption of organic pollutants dissolved in waterNANJING UNIVERSITY OF TECHNOLOGY·Filed 2019·Granted May 24, 2022·0 cites·4 claims
- 1057US7579686B2Thermal interface material with hotspot heat removerINTEL CORP·Filed 2006·Granted Aug 25, 2009·1 cites·20 claims
- 1156US7504453B2Composite thermal interface material including particles and nanofibersUNIV LELAND STANFORD JUNIOR·Filed 2004·Granted Mar 17, 2009·12 cites·17 claims
- 1243US2009004317A1High thermal conductivity molding compound for flip-chip packagesHU XUEJIAO·Filed 2007·Application pending·0 cites
- 1340US2009166844A1Metal cover on flip-chip matrix-array (fcmx) substrate for low cost cpu assemblyHU XUEJIAO·Filed 2007·Application pending·0 cites
- 1437US2006231946A1Nanotube surface coatings for improved wettabilityMOLECULAR NANOSYSTEMS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →