Inventor · disambiguated record
Xueyu Qian
Also filed as: QIAN XUEYU
9 granted patents·3 pending applications·1,441 citations·filing 1994–2012
91Inventor score
Top patents by PatentIndex Score
12 records- 0198US6635578B1Method of operating a dual chamber reactor with neutral density decoupled from ion densityAPPLIED MATERIALS INC·Filed 2000·Granted Oct 21, 2003·615 cites·51 claims
- 0296US6367410B1Closed-loop dome thermal control apparatus for a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1997·Granted Apr 9, 2002·620 cites·29 claims
- 0395US7503996B2Multiple frequency plasma chamber, switchable RF system, and processes using sameADVANCED MICRO FAB EQUIP INC·Filed 2007·Granted Mar 17, 2009·33 cites·21 claims
- 0488US5540800AInductively coupled high density plasma reactor for plasma assisted materials processingAPPLIED MATERIALS INC·Filed 1994·Granted Jul 30, 1996·119 cites·18 claims
- 0586US8366829B2Multi-station decoupled reactive ion etch chamberADVANCED MICRO FAB EQUIP INC·Filed 2007·Granted Feb 5, 2013·10 cites·17 claims
- 0684US6447637B1Process chamber having a voltage distribution electrodeAPPLIED MATERIALS INC·Filed 2000·Granted Sep 10, 2002·22 cites·12 claims
- 0770US6544896B1Method for enhancing etching of TiSixAPPLIED MATERIALS INC·Filed 2000·Granted Apr 8, 2003·16 cites·16 claims
- 0848US9208998B2Multi-station decoupled reactive ion etch chamberYIN GERALD·Filed 2012·Granted Dec 8, 2015·0 cites·20 claims
- 0947US2010271745A1Electrostatic chuck and base for plasma reactor having improved wafer etch rateADVANCED MICRO FAB EQUIP INC·Filed 2009·Application pending·0 cites
- 1044US2007079936A1Bonded multi-layer RF windowAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1140US2003006009A1Process chamber having a voltage distribution electrodeAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1235US6808647B1Methodologies to reduce process sensitivity to the chamber conditionAPPLIED MATERIALS INC·Filed 1999·Granted Oct 26, 2004·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →