Inventor · disambiguated record
Xunqing Shi
Also filed as: SHI XUNQING
12 granted patents·2 pending applications·125 citations·filing 2002–2017
90Inventor score
Files withHK APPLIED SCIENCE & TECH RES4SHI XUNQING3LAW PUI CHUNG SIMON2LEUNG CHI KUEN VINCENT2HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD1
Top patents by PatentIndex Score
14 records- 0191US8194411B2Electronic package with stacked modules with channels passing through metal layers of the modulesLEUNG CHI KUEN VINCENT·Filed 2009·Granted Jun 5, 2012·43 cites·11 claims
- 0288US8674482B2Semiconductor chip with through-silicon-via and sidewall padSHI XUNQING·Filed 2008·Granted Mar 18, 2014·22 cites·16 claims
- 0388US8212297B1High optical efficiency CMOS image sensorLAW PUI CHUNG SIMON·Filed 2011·Granted Jul 3, 2012·18 cites·15 claims
- 0486US8030208B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Oct 4, 2011·16 cites·11 claims
- 0578US8232626B2Via and method of via forming and method of via fillingTSUI YAT KIT·Filed 2010·Granted Jul 31, 2012·7 cites·22 claims
- 0677US9066424B2Partitioned hybrid substrate for radio frequency applicationsHK APPLIED SCIENCE & TECH RES·Filed 2013·Granted Jun 23, 2015·5 cites·13 claims
- 0776US7879438B2Substrate warpage-reducing structureHK APPLIED SCIENCE & TECH RES·Filed 2009·Granted Feb 1, 2011·5 cites·8 claims
- 0874US8138577B2Pulse-laser bonding method for through-silicon-via based stacking of electronic componentsSHI XUNQING·Filed 2008·Granted Mar 20, 2012·7 cites·26 claims
- 0962US10014280B2Three dimensional fully molded power electronics module having a plurality of spacers for high power applicationsHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2017·Granted Jul 3, 2018·1 cites·20 claims
- 1058US9075941B2Method for optimizing electrodeposition process of a plurality of vias in waferHK APPLIED SCIENCE & TECH RES·Filed 2013·Granted Jul 7, 2015·1 cites·19 claims
- 1138US8544165B2Apparatus for aligning electronic componentsLEUNG CHI KUEN VINCENT·Filed 2010·Granted Oct 1, 2013·0 cites·10 claims
- 1235US8772930B2Increased surface area electrical contacts for microelectronic packagesLAW PUI CHUNG SIMON·Filed 2012·Granted Jul 8, 2014·0 cites·20 claims
- 1334US2005146708A1Systems and methods for deformation measurementFiled 2002·Application pending·0 cites
- 1433US2011221018A1Electronic Device Package and Methods of Manufacturing an Electronic Device PackageSHI XUNQING·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →