Inventor · disambiguated record
Ya-Li Chen
Also filed as: CHEN YA · CHEN YA-LI
11 granted patents·5 pending applications·30 citations·filing 1993–2024
82Inventor score
Files withINGENTEC CORP11CHEN YA-LI2JIANGSU HENGRUI MEDICINE CO1PENG YU-CHIN1ZHONGTIAN TECH ADVANCED MATERIALS CO LTD1
Top patents by PatentIndex Score
16 records- 0181US11508872B2Alignment module for transferring a magnetic light-emitting die and alignment method thereofINGENTEC CORP·Filed 2021·Granted Nov 22, 2022·1 cites·20 claims
- 0281USD352873SHand trowelCHEN YA-LI·Filed 1993·Granted Nov 29, 1994·29 cites·1 claims
- 0372US11791439B2Magnetic light-emitting structureINGENTEC CORP·Filed 2023·Granted Oct 17, 2023·0 cites·5 claims
- 0466US12487188B2Wafer defect analyzing device and wafer defect analyzing methodINGENTEC CORP·Filed 2024·Granted Dec 2, 2025·0 cites·15 claims
- 0563US2024178631A1Laser diode and laser diode manufacturing methodINGENTEC CORP·Filed 2023·Application pending·0 cites
- 0661US11621368B2Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting elementINGENTEC CORP·Filed 2020·Granted Apr 4, 2023·0 cites·17 claims
- 0758US2025092026A1Method for preparing benzofuran derivativeJIANGSU HENGRUI MEDICINE CO·Filed 2022·Application pending·0 cites
- 0856US12417964B2Via-filling method of through-glass via substrateINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 0954US12418011B2Bonding and transferring method for die package structuresINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 1053US10622509B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2017·Granted Apr 14, 2020·0 cites·5 claims
- 1152US10622510B2Vertical type light emitting diode die and method for fabricating the sameINGENTEC CORP·Filed 2018·Granted Apr 14, 2020·0 cites·6 claims
- 1249US11981594B2Quartz glass with low content of hydroxyl and high purity and method for preparing the sameZHONGTIAN TECH ADVANCED MATERIALS CO LTD·Filed 2020·Granted May 14, 2024·0 cites·9 claims
- 1347US11769861B2Light-emitting diode packaging structure and method for fabricating the sameINGENTEC CORP·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 1439US2008280454A1Wafer recycling method using laser films strippingCHEN YA-LI·Filed 2007·Application pending·0 cites
- 1538US2020058523A1Gas etching deviceINGENTEC CORP·Filed 2018·Application pending·0 cites
- 1628US2006081833A1Package structure of light-emitting devicePENG YU-CHIN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →