Inventor · disambiguated record
Ya-Ming Chen
Also filed as: Chen ya-ming
5 granted patents·7 pending applications·0 citations·filing 2021–2025
59Inventor score
Files withTOKYO ELECTRON LTD12
Top patents by PatentIndex Score
12 records- 0171US2025273439A1Method of uniformity controlTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0270US12300468B2Method of uniformity controlTOKYO ELECTRON LTD·Filed 2022·Granted May 13, 2025·0 cites·14 claims
- 0365US12217935B2Plasma processing methods using multiphase multifrequency bias pulsesTOKYO ELECTRON LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0459US12341009B2Variable hardness amorphous carbon maskTOKYO ELECTRON LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0557US12040176B2Technologies for high aspect ratio carbon etching with inserted charge dissipation layerTOKYO ELECTRON LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 0657US2025079128A1Processing substrates with plasma modulated by dc magnetic fieldsTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0753US12009211B2Method for highly anisotropic etching of titanium oxide spacer using selective top-depositionTOKYO ELECTRON LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 0853US2024405022A1Non-planar transistor structures and methods of manufacturing thereofTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0951US2023377853A1Plasma systems and processes with pulsed magnetic fieldTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1051US2024258108A1Selective Deposition of Passivating Layer During Spacer EtchingTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1150US2023377895A1Plasma etching using multiphase multifrequency power pulses and variable duty cyclingTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1245US2023343554A1Methods To Provide Anisotropic Etching Of Metal Hard Masks Using A Radio Frequency Modulated Pulsed Plasma SchemeTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →