Inventor · disambiguated record
Yao-Hsien Chung
Also filed as: CHUNG YAO-HSIEN
8 granted patents·13 pending applications·5 citations·filing 2012–2025
76Inventor score
Top patents by PatentIndex Score
21 records- 0183US11688802B2High electron mobility transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 27, 2023·1 cites·13 claims
- 0282US2025331216A1Semiconductor structure and the forming method thereofUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0381US2025324646A1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0475US11037833B2Fabrication method of semiconductor device with spacer trimming processUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 15, 2021·2 cites·8 claims
- 0574US12376323B2Semiconductor structure and the forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 29, 2025·0 cites·9 claims
- 0671US10283618B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 7, 2019·2 cites·12 claims
- 0770US2023238455A1Method for fabricating high electron mobility transistorUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0870US2023282740A1High electron mobility transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0969US12015076B2HEMT and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jun 18, 2024·0 cites·8 claims
- 1069US11762293B2Fabricating method of reducing photoresist footingUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·11 claims
- 1162US11688790B2HEMT and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 27, 2023·0 cites·12 claims
- 1261US2025250405A1Expandable resin particle, expanded resin particle, foamed resin molded article and manufacturing method thereofLCY CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 1360US2025374565A1Mim capacitor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1460US2025374566A1Capacitor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1559US2025210553A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1659US2025234569A1Calabash-shaped mim capacitor structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1759US2025218693A1Capacitor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1859US2024110030A1Expandable resin particle, expanded resin particle, foamed resin molded article and manufacturing method thereofLCY CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1957US2025132210A1Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2054US9224887B2Solar cell and solar cell moduleAU OPTRONICS CORP·Filed 2012·Granted Dec 29, 2015·0 cites·18 claims
- 2144US2013064600A1Corner key and frame assembly thereofTSENG HUANG-CHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →