Inventor · disambiguated record
Yang Du
Also filed as: DU YANG
68 granted patents·32 pending applications·533 citations·filing 2001–2025
99Inventor score
Files withQUALCOMM INC54FREESCALE SEMICONDUCTOR INC8VANGUARD INT SEMICONDUCT CORP4CASSIDY TIMOTHY M3HENRY M JACKSON FOUND ADVANCEMENT MILITARY MEDICINE INC3
Top patents by PatentIndex Score
100 records- 0197US10121743B2Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)QUALCOMM INC·Filed 2017·Granted Nov 6, 2018·31 cites·16 claims
- 0297US9754923B1Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)QUALCOMM INC·Filed 2016·Granted Sep 5, 2017·30 cites·16 claims
- 0397US9343369B2Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systemsQUALCOMM INC·Filed 2014·Granted May 17, 2016·35 cites·14 claims
- 0496US9773741B1Bondable device including a hydrophilic layerQUALCOMM INC·Filed 2016·Granted Sep 26, 2017·20 cites·30 claims
- 0596US9177890B2Monolithic three dimensional integration of semiconductor integrated circuitsQUALCOMM INC·Filed 2013·Granted Nov 3, 2015·29 cites·4 claims
- 0694US11776174B1Fluorescence moleculartomography reconstruction method based on prior guidance of magnetic particle imagingUNIV BEIHANG·Filed 2023·Granted Oct 3, 2023·8 cites·6 claims
- 0794US7585735B2Asymmetric spacers and asymmetric source/drain extension layersFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 8, 2009·33 cites·18 claims
- 0893US9741691B2Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)QUALCOMM INC·Filed 2015·Granted Aug 22, 2017·14 cites·6 claims
- 0991US9256246B1Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs)QUALCOMM INC·Filed 2015·Granted Feb 9, 2016·10 cites·25 claims
- 1090US6765778B1Integrated vertical stack capacitorFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 20, 2004·63 cites·22 claims
- 1189US9171608B2Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICS), 3DIC processor cores, and methodsQUALCOMM INC·Filed 2013·Granted Oct 27, 2015·9 cites·17 claims
- 1288US9712168B1Process variation power control in three-dimensional (3D) integrated circuits (ICs) (3DICs)QUALCOMM INC·Filed 2016·Granted Jul 18, 2017·6 cites·20 claims
- 1388US8796741B2Semiconductor device and methods of making semiconductor device using grapheneQUALCOMM INC·Filed 2012·Granted Aug 5, 2014·8 cites·18 claims
- 1488US6969656B2Method and circuit for multiplying signals with a transistor having more than one independent gate structureFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 29, 2005·45 cites·25 claims
- 1587US9098666B2Clock distribution network for 3D integrated circuitQUALCOMM INC·Filed 2013·Granted Aug 4, 2015·8 cites·24 claims
- 1686US9583179B2Three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) tiers, and related 3D integrated circuits (3DICs), 3DIC processor cores, and methodsQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·5 cites·14 claims
- 1786US8984463B2Data transfer across power domainsQUALCOMM INC·Filed 2013·Granted Mar 17, 2015·7 cites·38 claims
- 1886US6563181B1High frequency signal isolation in a semiconductor deviceMOTOROLA INC·Filed 2001·Granted May 13, 2003·45 cites·20 claims
- 1985US10176147B2Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methodsQUALCOMM INC·Filed 2017·Granted Jan 8, 2019·5 cites·37 claims
- 2085US9536840B2Three-dimensional (3-D) integrated circuits (3DICS) with graphene shield, and related components and methodsQUALCOMM INC·Filed 2013·Granted Jan 3, 2017·7 cites·15 claims
- 2185US9321007B2Blends of amines with piperazine for CO2 captureUNIV TEXAS·Filed 2014·Granted Apr 26, 2016·7 cites·7 claims
- 2284US9147438B2Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methodsQUALCOMM INC·Filed 2014·Granted Sep 29, 2015·7 cites·21 claims
- 2382US9123721B2Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespaceQUALCOMM INC·Filed 2013·Granted Sep 1, 2015·5 cites·15 claims
- 2481US9013235B2Monolithic three dimensional (3D) flip-flops with minimal clock skew and related systems and methodsQUALCOMM INC·Filed 2013·Granted Apr 21, 2015·5 cites·20 claims
- 2581US6953738B2Method and apparatus for forming an SOI body-contacted transistorFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Oct 11, 2005·33 cites·12 claims
- 2679US7521720B2Semiconductor optical devices having fin structuresFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Apr 21, 2009·4 cites·14 claims
- 2778US12458920B2Compositions and methods for carbon dioxide captureUNIV ILLINOIS·Filed 2022·Granted Nov 4, 2025·0 cites·15 claims
- 2877US9076953B2Spin transistors employing a piezoelectric layer and related memory, memory systems, and methodsQUALCOMM INC·Filed 2013·Granted Jul 7, 2015·4 cites·14 claims
- 2977US9064077B23D floorplanning using 2D and 3D blocksQUALCOMM INC·Filed 2013·Granted Jun 23, 2015·5 cites·18 claims
- 3077US7112455B2Semiconductor optical devices and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Sep 26, 2006·10 cites·13 claims
- 3176US9418985B2Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technologyQUALCOMM INC·Filed 2013·Granted Aug 16, 2016·3 cites·20 claims
- 3274US9483598B2Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuitsQUALCOMM INC·Filed 2015·Granted Nov 1, 2016·2 cites·21 claims
- 3373US10510651B2Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macroQUALCOMM INC·Filed 2018·Granted Dec 17, 2019·1 cites·6 claims
- 3473US9869713B2Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systemsQUALCOMM INC·Filed 2015·Granted Jan 16, 2018·2 cites·27 claims
- 3573US9213358B2Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cross-tier clock skew management systems, methods and related componentsQUALCOMM INC·Filed 2014·Granted Dec 15, 2015·3 cites·15 claims
- 3673US9041448B2Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methodsQUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·20 claims
- 3772US11733766B2Ultra-low power neuromorphic artificial intelligence computing acceleratorQUALCOMM INC·Filed 2022·Granted Aug 22, 2023·0 cites·3 claims
- 3872US9628077B2Dual power swing pipeline design with separation of combinational and sequential logicsQUALCOMM INC·Filed 2015·Granted Apr 18, 2017·2 cites·26 claims
- 3972US2024321626A1Method of fabricating semiconductor structureVANGUARD INT SEMICONDUCT CORP·Filed 2024·Application pending·0 cites
- 4071US12325005B1Absorption medium and method for removing carbon dioxide from combustion exhaust gasEOG RESOURCES INC·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 4171US2024413236A1Method of fabricating high electron mobility transistorVANGUARD INT SEMICONDUCT CORP·Filed 2024·Application pending·0 cites
- 4270US9583473B2Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technologyQUALCOMM INC·Filed 2016·Granted Feb 28, 2017·1 cites·20 claims
- 4367US12027413B2Semiconductor structure and method of fabricating the sameVANGUARD INT SEMICONDUCT CORP·Filed 2021·Granted Jul 2, 2024·0 cites·10 claims
- 4467US10921627B2Methods of manufacturing display panels and display panelsYUNGU GUAN TECH CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·10 claims
- 4567US10005631B2Lateral positioning device for a sheet elementBOBST MEX SA·Filed 2015·Granted Jun 26, 2018·2 cites·19 claims
- 4667US9072379B2Television monitor combination stand and wall mountCASSIDY TIMOTHY M·Filed 2013·Granted Jul 7, 2015·5 cites·14 claims
- 4765US11108016B2Display screens and display devicesYUNGU GUAN TECH CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·17 claims
- 4864US9922956B2Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integrationQUALCOMM INC·Filed 2014·Granted Mar 20, 2018·1 cites·19 claims
- 4963US11004780B2Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macroQUALCOMM INC·Filed 2019·Granted May 11, 2021·0 cites·19 claims
- 5063US10365088B2Distributed measuring device and method for simultaneously measuring strain and temperature based on optical frequency domain reflectionUNIV TIANJIN·Filed 2016·Granted Jul 30, 2019·1 cites·7 claims
Showing the top 50 of 100 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →