Inventor · disambiguated record
Yasuhiro Horiike
Also filed as: HORIIKE YASUHIRO · SHIBAGAKI MASAHIRO · SUMITOMO YASUSUKE
45 granted patents·7 pending applications·1,707 citations·filing 1976–2010
99Inventor score
Files withTOKYO SHIBAURA ELECTRIC CO12TOSHIBA KK9SPEEDFAM CO LTD7TOKYO ELECTRON LTD6NAT INST FOR MATERIALS SCIENCE4
Top patents by PatentIndex Score
52 records- 0197US4492610ADry Etching method and device thereforTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Jan 8, 1985·72 cites·13 claims
- 0296US4151034AContinuous gas plasma etching apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1977·Granted Apr 24, 1979·121 cites·14 claims
- 0395US5185132AAtomspheric plasma reaction method and apparatus thereforJAPAN RES DEV CORP·Filed 1990·Granted Feb 9, 1993·95 cites·4 claims
- 0495US4065369AActivated gas reaction apparatus & methodTOKYO SHIBAURA ELECTRIC CO·Filed 1976·Granted Dec 27, 1977·81 cites·10 claims
- 0594US7691369B2Cultured cell construct which contains spheroids of cultured animal cells and the use thereofTRANSPARENT INC·Filed 2008·Granted Apr 6, 2010·31 cites·4 claims
- 0694US4277304AIon source and ion etching processTOKYO SHIBAURA ELECTRIC CO·Filed 1979·Granted Jul 7, 1981·61 cites·9 claims
- 0792US5487785APlasma treatment apparatusTOKYO ELECTRON LTD·Filed 1994·Granted Jan 30, 1996·152 cites·20 claims
- 0891US7470424B2Cultured cell construct containing spheroids of cultured animal cells and utilization thereofTRANSPARENT INC·Filed 2002·Granted Dec 30, 2008·33 cites·18 claims
- 0989US5290609AMethod of forming dielectric film for semiconductor devicesTOKYO ELECTRON LTD·Filed 1992·Granted Mar 1, 1994·123 cites·12 claims
- 1089US4160690AGas etching method and apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1978·Granted Jul 10, 1979·53 cites·12 claims
- 1188US4529475ADry etching apparatus and method using reactive gasesTOSHIBA KK·Filed 1984·Granted Jul 16, 1985·68 cites·36 claims
- 1287US7972577B2Chip using method and test chipNAT INST FOR MATERIALS SCIENCE·Filed 2010·Granted Jul 5, 2011·11 cites·3 claims
- 1387US4431473ARIE Apparatus utilizing a shielded magnetron to enhance etchingTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted Feb 14, 1984·65 cites·12 claims
- 1485US4252595AEtching apparatus using a plasmaTOKYO SHIBAURA ELECTRIC CO·Filed 1978·Granted Feb 24, 1981·46 cites·6 claims
- 1585US4123663AGas-etching deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1976·Granted Oct 31, 1978·44 cites·11 claims
- 1684US4838978ADry etching apparatusTOSHIBA KK·Filed 1987·Granted Jun 13, 1989·70 cites·13 claims
- 1783US4175235AApparatus for the plasma treatment of semiconductorsTOKYO SHIBAURA ELECTRIC CO·Filed 1977·Granted Nov 20, 1979·29 cites·9 claims
- 1883US4094722AEtching apparatus using a plasmaTOKYO SHIBAURA ELECTRIC CO·Filed 1977·Granted Jun 13, 1978·41 cites·10 claims
- 1982US4642171APhototreating apparatusTOSHIBA KK·Filed 1985·Granted Feb 10, 1987·32 cites·9 claims
- 2080US5851600APlasma process method and apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Dec 22, 1998·35 cites·10 claims
- 2180US4526643ADry etching apparatus using reactive ionsTOKYO SHIBAURA ELECTRIC CO·Filed 1984·Granted Jul 2, 1985·46 cites·19 claims
- 2275US6155200AECR plasma generator and an ECR system using the generatorTOKYO ELECTRON LTD·Filed 1998·Granted Dec 5, 2000·45 cites·10 claims
- 2375US4192706AGas-etching deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1978·Granted Mar 11, 1980·28 cites·14 claims
- 2468US7678577B2Blood analysis apparatus and blood analysis methodNAT INST FOR MATERIALS SCIENCE·Filed 2005·Granted Mar 16, 2010·2 cites·21 claims
- 2568US7582259B2Blood analysis device and blood analysis methodJAPAN SCIENCE & TECH AGENCY·Filed 2004·Granted Sep 1, 2009·11 cites·19 claims
- 2668US6360687B1Wafer flattening systemSPEEDFAM IPEC CO LTD·Filed 1999·Granted Mar 26, 2002·38 cites·16 claims
- 2767US6316369B1Corrosion-resistant system and method for a plasma etching apparatusSPEEDFAM CO LTD·Filed 2000·Granted Nov 13, 2001·6 cites·11 claims
- 2866US4878995AMethod of dry etching and apparatus for use in such methodTOSHIBA KK·Filed 1988·Granted Nov 7, 1989·30 cites·34 claims
- 2965US7691328B2Chip using method and test chipNAT INST FOR MATERIALS SCIENCE·Filed 2004·Granted Apr 6, 2010·7 cites·7 claims
- 3065US4668337ADry-etching method and apparatus thereforTOSHIBA KK·Filed 1985·Granted May 26, 1987·29 cites·25 claims
- 3164US4786361ADry etching processTOSHIBA KK·Filed 1987·Granted Nov 22, 1988·28 cites·16 claims
- 3262US6159388APlasma etching method and plasma etching system for carrying out the sameSPEEDFAM CO LTD·Filed 1998·Granted Dec 12, 2000·26 cites·15 claims
- 3360US4698238APattern-forming methodTOSHIBA KK·Filed 1986·Granted Oct 6, 1987·25 cites·11 claims
- 3456US6461533B1Etchant for silicon oxide and methodAPPLIED MATERIALS INC·Filed 1998·Granted Oct 8, 2002·20 cites·5 claims
- 3555US6451217B1Wafer etching methodSPEEDFAM IPEC CO LTD·Filed 2000·Granted Sep 17, 2002·5 cites·8 claims
- 3652US6280645B1Wafer flattening process and systemYASUHIRO HORIIKE AND SPEEDFAM·Filed 1999·Granted Aug 28, 2001·17 cites·6 claims
- 3751US5308791AMethod and apparatus for processing surface of semiconductor layerTOKYO ELECTRON LTD·Filed 1992·Granted May 3, 1994·21 cites·7 claims
- 3850US4341593APlasma etching method for aluminum-based filmsTOKUDA SEISAKUSHO·Filed 1980·Granted Jul 27, 1982·18 cites·8 claims
- 3944US6096176ASputtering method and a sputtering apparatus thereofTOKYO ELECTRON LTD·Filed 1995·Granted Aug 1, 2000·11 cites·7 claims
- 4044US2008138890A1Blood Analysis ApparatusNAT INST FOR MATERIALS SCIENCE·Filed 2005·Application pending·0 cites
- 4142US5997700AMethod of fabricating magnetic head sliderCITIZEN WATCH CO LTD·Filed 1995·Granted Dec 7, 1999·6 cites·3 claims
- 4241US6254718B1Combined CMP and plasma etching wafer flattening systemSPEEDFAM CO LTD·Filed 1999·Granted Jul 3, 2001·9 cites·3 claims
- 4340US5855728AMethod for cleaning vulcanization moldBRIDGESTONE CORP·Filed 1997·Granted Jan 5, 1999·7 cites·8 claims
- 4440US2006084174A1Blood analyzer and method of separating plasmaOGAWA HIROKI·Filed 2003·Application pending·0 cites
- 4540US2003114785A1Blood analyzing method and apparatusFiled 2001·Application pending·0 cites
- 4639US2001007275A1Wafer flattening process and systemSPEEDFAM CO LTD·Filed 2001·Application pending·0 cites
- 4737US2004063329A1Multi-step local dry etching method for SOI waferSPEEDFAM CO LTD·Filed 2003·Application pending·0 cites
- 4835US2002008082A1Local etching apparatus and local etching methodSPEEDFAM CO LTD·Filed 2001·Application pending·0 cites
- 4933US5112645APhototreating method and apparatus thereforTOSHIBA KK·Filed 1990·Granted May 12, 1992·4 cites·5 claims
- 5032US4844774APhototreating method and apparatus thereforTOSHIBA KK·Filed 1988·Granted Jul 4, 1989·3 cites·8 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →