Inventor · disambiguated record
Yao-Te Huang
Also filed as: HUANG YAO-TE
45 granted patents·13 pending applications·398 citations·filing 2005–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25TAIWAN SEMICONDUCTOR MFG8XYZPRINTING INC6HUANG YAO-TE4CHUNG TIEN-KAN2
Top patents by PatentIndex Score
58 records- 0199US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 0298US9181083B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·52 cites·20 claims
- 0396US10785158B1System and method for provisioning both IPV4 and IPV6 internet service and load balancer serviceCHUNGHWA TELECOM CO LTD·Filed 2019·Granted Sep 22, 2020·19 cites·20 claims
- 0493US8952626B2Lighting control systems and methodsHUANG YAO-TE·Filed 2011·Granted Feb 10, 2015·43 cites·31 claims
- 0590US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 0690US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 0789US11764143B2Increasing contact areas of contacts for MIM capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 19, 2023·2 cites·18 claims
- 0887US9718239B2Three dimensional printing apparatus and three dimensional printing methodXYZPRINTING INC·Filed 2015·Granted Aug 1, 2017·4 cites·10 claims
- 0986US10266390B2Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 1085US10779100B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·3 cites·20 claims
- 1185US8928162B2Sensor with energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 6, 2015·4 cites·20 claims
- 1284US11858272B2Ink circulation systemKINPO ELECT INC·Filed 2022·Granted Jan 2, 2024·1 cites·13 claims
- 1382US2025316577A1Increasing contact areas of contacts for mim capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1479US12230603B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 1579US2025357310A1Passive Device StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1677US9998843B2Method for manufacturing a microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·1 cites·7 claims
- 1776US2025218877A1Semiconductor Structure and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1874US12283532B2Semiconductor structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 1973US7513588B2Apparatus and method for supplying voltage to nozzle in inkjet printerQISDA CORP·Filed 2006·Granted Apr 7, 2009·3 cites·9 claims
- 2073US2024395728A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2172US9462402B2Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·2 cites·20 claims
- 2272US9264833B2Structure and method for integrated microphoneTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·2 cites·20 claims
- 2372US2025183225A1Method of fabricating a semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2470US2024145430A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2569US11756924B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 2668US11678133B2Structure for integrated microphoneTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·0 cites·20 claims
- 2768US11443991B2Semiconductor structure and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 2868US9269679B2Wafer level packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 2965US12142574B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 3065US11908829B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3165US10252464B2Slicing printing method for color 3D modelXYZPRINTING INC·Filed 2016·Granted Apr 9, 2019·1 cites·14 claims
- 3265US8723343B2Sensor with energy-harvesting deviceCHUNG TIEN-KAN·Filed 2011·Granted May 13, 2014·1 cites·20 claims
- 3364US11130670B2MEMS devices with an element having varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 3464US8735260B2Method to prevent metal pad damage in wafer level packageTSAI SHANG-YING·Filed 2010·Granted May 27, 2014·1 cites·20 claims
- 3564US2023395488A1Passive Device StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3663US8111009B2Light adjustment circuit for alternating-current light emitting diodes (AC-LED's)TSAI WEN-TIEN·Filed 2009·Granted Feb 7, 2012·4 cites·10 claims
- 3762US9584003B2Energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
- 3862US9246401B2Energy-harvesting device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 26, 2016·0 cites·20 claims
- 3961US8242757B2Constant power control apparatus and control method thereofHUANG YAO-TE·Filed 2009·Granted Aug 14, 2012·2 cites·21 claims
- 4060US9673169B2Method and apparatus for a wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 6, 2017·1 cites·20 claims
- 4157US8410665B2MEMS kinetic energy conversionCHUNG TIEN-KAN·Filed 2010·Granted Apr 2, 2013·1 cites·14 claims
- 4257US2007001022A1Drinking strawCHUANG HSING-LIEH·Filed 2006·Application pending·0 cites
- 4356US11660876B2Detection method for liquid level of storage tankKINPO ELECT INC·Filed 2022·Granted May 30, 2023·0 cites·15 claims
- 4456US8763220B2Method of manufacturing a MEMS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 1, 2014·0 cites·18 claims
- 4555US9981427B2Sensing device for three-dimensional printing objectXYZPRINTING INC·Filed 2015·Granted May 29, 2018·0 cites·11 claims
- 4655US9034677B2MEMS device and method of formation thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 19, 2015·0 cites·20 claims
- 4752US9545691B2Method of removing waste of substrate and waste removing device thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 17, 2017·0 cites·21 claims
- 4852US2009231371A1Apparatus and method for supplying voltage to nozzle in inkjet printerBENQ CORP·Filed 2009·Application pending·0 cites
- 4949US10343391B2Three-dimensional printing apparatus and three-dimensional printing methodXYZPRINTING INC·Filed 2017·Granted Jul 9, 2019·0 cites·8 claims
- 5049US2021255025A1Method of detecting liquid level of printing material of three-dimensional printerXYZPRINTING INC·Filed 2020·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →