Inventor · disambiguated record
Yao-Ting Huang
Also filed as: HUANG YAO-TING
17 granted patents·5 pending applications·128 citations·filing 2002–2013
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG12IND TECH RES INST4ASE SHANGHAI INC1HUANG YAO-TING1IND TECHNOLOGY RES INSITUTE1
Top patents by PatentIndex Score
22 records- 0192US7473629B2Substrate structure having a solder mask and a process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 6, 2009·30 cites·9 claims
- 0288US7602053B2Leadframe of a leadless flip-chip package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Oct 13, 2009·15 cites·34 claims
- 0387US7335987B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 26, 2008·15 cites·12 claims
- 0478US7157292B2Leadframe for a multi-chip package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jan 2, 2007·8 cites·7 claims
- 0577US7312105B2Leadframe of a leadless flip-chip package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 25, 2007·7 cites·8 claims
- 0677US7101733B2Leadframe with a chip pad for two-sided stacking and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Sep 5, 2006·8 cites·5 claims
- 0773US7575957B2Leadless semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 18, 2009·7 cites·16 claims
- 0872US6722412B2Die bonderADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 20, 2004·16 cites·13 claims
- 0971US7656043B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Feb 2, 2010·4 cites·11 claims
- 1065US7782466B2Method and apparatus for resonant frequency identification through out-of-plane displacement detectionIND TECHNOLOGY RES INSITUTE·Filed 2007·Granted Aug 24, 2010·4 cites·15 claims
- 1163US7536265B2Signal analysis method for vibratory interferometryIND TECH RES INST·Filed 2007·Granted May 19, 2009·4 cites·7 claims
- 1263US7511366B2Multi-row substrate strip and method for manufacturing the sameASE SHANGHAI INC·Filed 2005·Granted Mar 31, 2009·3 cites·20 claims
- 1362US7748111B2Manufacturing process of a carrierADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jul 6, 2010·4 cites·13 claims
- 1460US7965394B2Method and apparatus for identifying dynamic characteristics of a vibratory objectIND TECH RES INST·Filed 2008·Granted Jun 21, 2011·3 cites·15 claims
- 1548US8035820B2Method and apparatus for resonant frequency identification through out-of-plane displacement detectionIND TECH RES INST·Filed 2010·Granted Oct 11, 2011·0 cites·16 claims
- 1645US2008232077A1Conversion substrate for a leadframe and the method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1740US2006022316A1Semiconductor package with flip chip on leadless leadframeADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1839US2013097543A1Capture-and-paste method for electronic deviceKDAN MOBILE SOFTWARE LTD·Filed 2012·Application pending·0 cites
- 1938US2004127011A1[method of assembling passive component]Filed 2003·Application pending·0 cites
- 2035US2006091558A1Circuitized substrate with trace embedded inside ground layerHUANG YAO-TING·Filed 2005·Application pending·0 cites
- 2134US9034654B2Method for analyzing the liquefied petroleum gas and device thereofIND TECH RES INST·Filed 2013·Granted May 19, 2015·0 cites·11 claims
- 2233US8968595B2Methods for recycling liquid crystal and forming reformulated liquid crystal mixturesLU CHIEN-WEI·Filed 2011·Granted Mar 3, 2015·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →