Inventor · disambiguated record
Yasuhiro Inokuchi
Also filed as: INOKUCHI YASUHIRO
31 granted patents·9 pending applications·799 citations·filing 1997–2025
97Inventor score
Files withHITACHI INT ELECTRIC INC17KOKUSAI ELECTRIC CO LTD8KOKUSAI ELECTRIC CORP8MORIYA ATSUSHI2INOKUCHI YASUHIRO1
Top patents by PatentIndex Score
40 records- 0196US6503079B2Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Jan 7, 2003·478 cites·18 claims
- 0294US7861668B2Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2007·Granted Jan 4, 2011·19 cites·5 claims
- 0392US11705325B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 18, 2023·1 cites·21 claims
- 0489US8652258B2Substrate treatment deviceYOKOGAWA TAKASHI·Filed 2011·Granted Feb 18, 2014·9 cites·4 claims
- 0589US8020514B2Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Sep 20, 2011·9 cites·6 claims
- 0686US8028652B2Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2007·Granted Oct 4, 2011·7 cites·18 claims
- 0784US12266522B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Apr 1, 2025·0 cites·17 claims
- 0883US2025022702A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0982US9039912B2Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted May 26, 2015·3 cites·15 claims
- 1082US8071477B2Method of manufacturing semiconductor device and substrate processing apparatusMORIYA ATSUSHI·Filed 2009·Granted Dec 6, 2011·6 cites·5 claims
- 1181US12142476B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 12, 2024·0 cites·21 claims
- 1281US11361961B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 14, 2022·1 cites·17 claims
- 1380US8070880B2Substrate processing apparatusMARUBAYASHI TETSUYA·Filed 2008·Granted Dec 6, 2011·11 cites·17 claims
- 1480US6217663B1Substrate processing apparatus and substrate processing methodKOKUSAI ELECTRIC CO LTD·Filed 1997·Granted Apr 17, 2001·69 cites·58 claims
- 1579US6332927B1Substrate processing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2000·Granted Dec 25, 2001·20 cites·5 claims
- 1678US2025201551A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1777US11915927B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 27, 2024·0 cites·19 claims
- 1874US6872636B2Method for fabricating a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2002·Granted Mar 29, 2005·13 cites·10 claims
- 1972US8025739B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Granted Sep 27, 2011·1 cites·2 claims
- 2069US11527401B2Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 2169US6462411B1Semiconductor wafer processing apparatus for transferring a wafer mountKOKUSAI ELECTRIC CO LTD·Filed 1998·Granted Oct 8, 2002·40 cites·28 claims
- 2267US8466049B2Semiconductor device producing method with selective epitaxial growthINOKUCHI YASUHIRO·Filed 2006·Granted Jun 18, 2013·4 cites·11 claims
- 2367US5960159AHeat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entiretyKOKUSAI ELECTRIC CO LTD·Filed 1997·Granted Sep 28, 1999·37 cites·20 claims
- 2462US8790463B2Substrate processing apparatus and semiconductor device producing methodMORIYA ATSUSHI·Filed 2005·Granted Jul 29, 2014·2 cites·2 claims
- 2562US2008135516A1Substrate treatment deviceHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 2661US8544411B2Batch-type remote plasma processing apparatusTOYODA KAZUYUKI·Filed 2009·Granted Oct 1, 2013·1 cites·5 claims
- 2761US8012885B2Manufacturing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2008·Granted Sep 6, 2011·1 cites·8 claims
- 2860US6139641ASubstrate processing apparatus having a gas heating tubeKOKUSAI ELECTRIC CO LTD·Filed 1997·Granted Oct 31, 2000·21 cites·27 claims
- 2959US9373499B2Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Jun 21, 2016·0 cites·18 claims
- 3058US6270581B1Wet-oxidation apparatus and wet-oxidation methodKOKUSAI ELECTRIC CO LTD·Filed 1998·Granted Aug 7, 2001·12 cites·27 claims
- 3152US2011226418A1Method of manufacturing semiconductor deviceISHIBASHI KIYOHISA·Filed 2011·Application pending·0 cites
- 3251US7851379B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Dec 14, 2010·0 cites·8 claims
- 3351US6949474B2Method of manufacturing a semiconductor device and a semiconductor manufacture systemHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 27, 2005·3 cites·10 claims
- 3451US6132553ASubstrate processing apparatusKOKUSAI ELECTRIC CO LTD·Filed 1998·Granted Oct 17, 2000·17 cites·15 claims
- 3548US6764916B1Manufacturing method for semiconductor deviceHITACHI INT ELECTRIC INC·Filed 1999·Granted Jul 20, 2004·14 cites·14 claims
- 3648US2010154711A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 3747US2009253265A1Method for fabricating semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 3847US2008199610A1Substrate processing apparatus, and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 3943US2003164143A1Batch-type remote plasma processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Application pending·0 cites
- 4041US2001019902A1Wet-oxidation apparatus and wet-oxidation methodKOKUSAI ELECTRIC CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →