Inventor · disambiguated record
Yasunori Karasawa
Also filed as: KARASAWA YASUNORI
4 granted patents·3 pending applications·3 citations·filing 2007–2021
59Inventor score
Top patents by PatentIndex Score
7 records- 0156US2009029161A1Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheetLINTEC CORP·Filed 2008·Application pending·0 cites
- 0255US8445092B2Resin sheet for circuit boards, sheet for circuit boards and circuit board displaysKARASAWA YASUNORI·Filed 2009·Granted May 21, 2013·2 cites·4 claims
- 0351US8716401B2Semiconductor chip laminate and adhesive composition for semiconductor chip laminationKARASAWA YASUNORI·Filed 2009·Granted May 6, 2014·1 cites·2 claims
- 0446US12247124B2Resin sheetLINTEC CORP·Filed 2021·Granted Mar 11, 2025·0 cites·11 claims
- 0542US2022145151A1Resin sheetLINTEC CORP·Filed 2020·Application pending·0 cites
- 0639US11512200B2Resin composition, resin sheet, laminate, and semiconductor elementLINTEC CORP·Filed 2017·Granted Nov 29, 2022·0 cites·11 claims
- 0731US2010003481A1Display substrate for embedding pixel-controlling elementsNAKABAYASHI MASAHITO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →