Inventor · disambiguated record
Yasuhisa Kayaba
Also filed as: KAYABA YASUHISA
16 granted patents·4 pending applications·7 citations·filing 2013–2022
86Inventor score
Files withMITSUI CHEMICALS INC20
Top patents by PatentIndex Score
20 records- 0181US10752805B2Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor deviceMITSUI CHEMICALS INC·Filed 2016·Granted Aug 25, 2020·2 cites·14 claims
- 0274US9780008B2Semiconductor device, method for manufacturing the same, and rinsing liquidMITSUI CHEMICALS INC·Filed 2013·Granted Oct 3, 2017·3 cites·7 claims
- 0370US11965109B2Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor deviceMITSUI CHEMICALS INC·Filed 2020·Granted Apr 23, 2024·0 cites·14 claims
- 0470US9169353B2Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the sameMITSUI CHEMICALS INC·Filed 2013·Granted Oct 27, 2015·2 cites·16 claims
- 0555US12261143B2Method of manufacturing substrate layered body and layered bodyMITSUI CHEMICALS INC·Filed 2019·Granted Mar 25, 2025·0 cites·14 claims
- 0655US10759964B2Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor deviceMITSUI CHEMICALS INC·Filed 2016·Granted Sep 1, 2020·0 cites·14 claims
- 0752US2024371713A1Composition for forming film for semiconductor, laminate, and substrate laminateMITSUI CHEMICALS INC·Filed 2022·Application pending·0 cites
- 0852US2024384132A1Composition for forming film for semiconductor, laminate, and substrate laminateMITSUI CHEMICALS INC·Filed 2022·Application pending·0 cites
- 0951US11487205B2Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor elementMITSUI CHEMICALS INC·Filed 2018·Granted Nov 1, 2022·0 cites·21 claims
- 1050US10580639B2Sealing composition and method of manufacturing semiconductor deviceMITSUI CHEMICALS INC·Filed 2015·Granted Mar 3, 2020·0 cites·18 claims
- 1150US2023275057A1Composition, multilayer body and method for producing multilayer bodyMITSUI CHEMICALS INC·Filed 2021·Application pending·0 cites
- 1247US10020238B2Method for manufacturing composite body and compositionMITSUI CHEMICALS INC·Filed 2014·Granted Jul 10, 2018·0 cites·17 claims
- 1345US11859110B2Substrate laminated body and method of manufacturing substrate laminated bodyMITSUI CHEMICALS INC·Filed 2018·Granted Jan 2, 2024·0 cites·17 claims
- 1444US2021375710A1Semiconductor element intermediate, and method of producing semiconductor element intermediateMITSUI CHEMICALS INC·Filed 2019·Application pending·0 cites
- 1542US10950532B2Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation methodMITSUI CHEMICALS INC·Filed 2015·Granted Mar 16, 2021·0 cites·11 claims
- 1642US10043677B2Method for manufacturing filling planarization film and method for manufacturing electronic deviceMITSUI CHEMICALS INC·Filed 2016·Granted Aug 7, 2018·0 cites·9 claims
- 1739US11581197B2Method for producing semiconductor device and intermediate for semiconductor deviceMITSUI CHEMICALS INC·Filed 2018·Granted Feb 14, 2023·0 cites·11 claims
- 1837US11209735B2Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor deviceMITSUI CHEMICALS INC·Filed 2017·Granted Dec 28, 2021·0 cites·15 claims
- 1937US10988647B2Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing sameMITSUI CHEMICALS INC·Filed 2018·Granted Apr 27, 2021·0 cites·18 claims
- 2036US11474429B2Method of producing substrate with fine uneven pattern, resin composition, and laminateMITSUI CHEMICALS INC·Filed 2018·Granted Oct 18, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →