Inventor · disambiguated record
Yasushi Kumashiro
Also filed as: KUMASHIRO YASUSHI
15 granted patents·6 pending applications·348 citations·filing 1996–2016
93Inventor score
Top patents by PatentIndex Score
21 records- 0195US6673441B1Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2000·Granted Jan 6, 2004·55 cites·23 claims
- 0289US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0388US6838170B2Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jan 4, 2005·24 cites·46 claims
- 0482US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0582US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 0680US9676969B2Composition set, conductive substrate and method of producing the same, and conductive adhesive compositionNAKAKO HIDEO·Filed 2012·Granted Jun 13, 2017·3 cites·18 claims
- 0780US6090468AMultilayer wiring board for mounting semiconductor device and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 18, 2000·63 cites·18 claims
- 0875US9228100B2Liquid composition, and resistor film, resistor element and circuit board using sameKUMASHIRO YASUSHI·Filed 2011·Granted Jan 5, 2016·2 cites·12 claims
- 0975US5965269AAdhesive, adhesive film and adhesive-backed metal foilHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 12, 1999·40 cites·26 claims
- 1063US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 1163US7700185B2Insulation material, film, circuit board and method of producing themHITACHI CHEMICAL CO LTD·Filed 2004·Granted Apr 20, 2010·9 cites·49 claims
- 1261US9650528B2Liquid composition, and resistor film, resistor element and circuit boardHITACHI CHEMICAL CO LTD·Filed 2014·Granted May 16, 2017·0 cites·16 claims
- 1361US8040486B2Ink for forming liquid crystal spacer and liquid crystal display device using such inkHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 18, 2011·1 cites·17 claims
- 1453US6197149B1Production of insulating varnishes and multilayer printed circuit boards using these varnishesHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 6, 2001·15 cites·13 claims
- 1549US2013295276A1Method for forming a copper wiring patternHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1648US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 1747US2009134386A1Organic Field Effect TransistorNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 1844US2011141428A1Process for producing spacer for liquid crystal display apparatus, ink for spacer formation, liquid crystal display appartus and process for manufacturing the sameMARUYAMA NAOKI·Filed 2007·Application pending·0 cites
- 1941US9550940B2Etching materialHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 24, 2017·0 cites·9 claims
- 2039US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
- 2133US2018029121A1Copper-containing particles, conductor-forming composition, method of producing conductior, conductor, and apparatusHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →