Inventor · disambiguated record
Yasuyoshi Kuroda
Also filed as: KURODA YASUYOSHI
36 granted patents·7 pending applications·378 citations·filing 1993–2024
97Inventor score
Top patents by PatentIndex Score
43 records- 0193US10734132B2Bio-electrode composition, bio-electrode, method for manufacturing the bio-electrode, and polymer compoundSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 4, 2020·3 cites·19 claims
- 0290US11160480B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Nov 2, 2021·2 cites·21 claims
- 0389US6234879B1Method and apparatus for wafer chamfer polishingSHINETSU HANDOTAI KK·Filed 1996·Granted May 22, 2001·76 cites·1 claims
- 0485US11732169B2Silicone adhesive composition, adhesive tape, adhesive sheet and double-sided adhesive sheetSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 22, 2023·1 cites·12 claims
- 0585US10610116B2Adhesive composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2017·Granted Apr 7, 2020·1 cites·20 claims
- 0681US5733181AApparatus for polishing the notch of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Mar 31, 1998·38 cites·11 claims
- 0780US10792489B2Bio-electrode composition, bio-electrode, and method for manufacturing the bio-electrodeSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 6, 2020·4 cites·11 claims
- 0880US5727990AMethod for mirror-polishing chamfered portion of wafer and mirror-polishing apparatusSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 17, 1998·49 cites·8 claims
- 0980US5476413AApparatus for polishing the periphery portion of a waferSHINETSU HANDOTAI KK·Filed 1994·Granted Dec 19, 1995·52 cites·6 claims
- 1079US6756127B2Primer composition for silicone pressure-sensitive adhesivesSHINETSU CHEMICAL CO·Filed 2002·Granted Jun 29, 2004·11 cites·17 claims
- 1178US10695554B2Bio-electrode composition, bio-electrode, method for manufacturing the bio-electrode, and polymerSHINETSU CHEMICAL CO·Filed 2018·Granted Jun 30, 2020·2 cites·14 claims
- 1277US8466041B2Method for manufacturing lamination type semiconductor integrated deviceKURODA YASUYOSHI·Filed 2010·Granted Jun 18, 2013·6 cites·25 claims
- 1376US10808148B2Adhesive composition, bio-electrode, method for manufacturing a bio-electrode, and saltSHINETSU CHEMICAL CO·Filed 2017·Granted Oct 20, 2020·2 cites·18 claims
- 1473US5547415AMethod and apparatus for wafer chamfer polishingSHINETSU HANDOTAI KK·Filed 1993·Granted Aug 20, 1996·25 cites·17 claims
- 1573US2025019583A1Ultrasound Coupling Material Composition, Ultrasound Coupling Material Film, And Ultrasound Inspection MethodSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1672US12419561B2Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrodeSHINETSU CHEMICAL CO·Filed 2021·Granted Sep 23, 2025·0 cites·22 claims
- 1772US6559246B2Primer composition for silicone pressure-sensitive adhesivesSHINETSU CHEMICAL CO·Filed 2001·Granted May 6, 2003·7 cites·18 claims
- 1870US5882539AWafer processing method and equipment thereforSHINETSU HANDOTAI KK·Filed 1996·Granted Mar 16, 1999·37 cites·24 claims
- 1969US5404678AWafer chamfer polishing apparatus with rotary circular dividing tableFiled 1993·Granted Apr 11, 1995·26 cites·8 claims
- 2068US11896377B2Bio-electrodeSHINETSU CHEMICAL CO·Filed 2021·Granted Feb 13, 2024·0 cites·18 claims
- 2166US11517236B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 6, 2022·0 cites·20 claims
- 2265US11607162B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Mar 21, 2023·0 cites·16 claims
- 2363US11612347B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Mar 28, 2023·0 cites·16 claims
- 2461US11135422B2Bio-electrode and methods for manufacturing the bio-electrodeSHINETSU CHEMICAL CO·Filed 2020·Granted Oct 5, 2021·0 cites·4 claims
- 2560US11998339B2Bio-electrode composition, bio-electrode, and method for manufacturing bio-electrodeSHINETSU CHEMICAL CO·Filed 2021·Granted Jun 4, 2024·0 cites·19 claims
- 2659US12473473B2Silicone release agent composition and a release paper or filmSHINETSU CHEMICAL CO·Filed 2019·Granted Nov 18, 2025·0 cites·19 claims
- 2757US5928066AApparatus for polishing peripheral portion of waferSHINETSU HANDOTAI KK·Filed 1997·Granted Jul 27, 1999·19 cites·16 claims
- 2856US11702574B2Adhesive silicone composition and an adhesive film or tapeSHINETSU CHEMICAL CO·Filed 2019·Granted Jul 18, 2023·0 cites·13 claims
- 2956US5538463AApparatus for bevelling wafer-edgeSHINETSU HANDOTAI KK·Filed 1993·Granted Jul 23, 1996·14 cites·17 claims
- 3056US2021309900A1Addition reaction-curable silicone adhesive composition for skin application and adhesive tape for skin applicationSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3155US11547354B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Jan 10, 2023·0 cites·30 claims
- 3255US2021348042A1Method for producing silicone adhesive compositionSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3354US2021317353A1Silicone adhesive agent composition, and adhesive tape or adhesive film using sameSHINETSU CHEMICAL CO·Filed 2019·Application pending·0 cites
- 3454US2009012218A1Silicone pressure-sensitive adhesive composition having antistatic performance and silicone pressure-sensitive adhesive tapeSHINETSU CHEMICAL CO·Filed 2008·Application pending·0 cites
- 3553US11839476B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 12, 2023·0 cites·15 claims
- 3653US11234606B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 3753US2006172140A1Silicone pressure sensitive adhesive composition and a pressure sensitive adhesive tape thereofSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 3851US11801333B2Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2019·Granted Oct 31, 2023·0 cites·20 claims
- 3950US10844257B2Adhesive composition, bio-electrode, and method for manufacturing a bio-electrodeSHINETSU CHEMICAL CO·Filed 2017·Granted Nov 24, 2020·0 cites·20 claims
- 4050US2011111217A1Silicone base pressure-sensitive adhesive composition and filmSHINETSU CHEMICAL CO·Filed 2010·Application pending·0 cites
- 4148US10696881B2Silicone adhesive composition and an adhesive tapeSHINETSU CHEMICAL CO·Filed 2016·Granted Jun 30, 2020·0 cites·16 claims
- 4245US10072189B2Silicone adhesive composition, a method for the preparation thereof and an adhesive filmSHINETSU CHEMICAL CO·Filed 2015·Granted Sep 11, 2018·0 cites·6 claims
- 4331US5766065AApparatus for polishing peripheral portion of waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jun 16, 1998·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →