Inventor · disambiguated record
Ya Huei Lee
Also filed as: LEE YA HUEI
4 granted patents·3 pending applications·27 citations·filing 2010–2025
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US11854956B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0292US8415808B2Semiconductor device with die stack arrangement including staggered die and efficient wire bondingLIAO CHIH-CHIN·Filed 2010·Granted Apr 9, 2013·24 cites·8 claims
- 0381US12412827B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 0481US2025309089A1Semiconductor die package with conductive line crack prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0571US2025357220A1Electrical testing of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0662US2024387296A1Electrical testing of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0761US8853863B2Semiconductor device with die stack arrangement including staggered die and efficient wire bondingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Oct 7, 2014·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →