Inventor · disambiguated record
Yan Li
Also filed as: LI YAN · Li yan ni
14 granted patents·1 pending application·142 citations·filing 2016–2021
91Inventor score
Top patents by PatentIndex Score
15 records- 0198US11133325B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·14 cites·9 claims
- 0298US10249640B2Within-array through-memory-level via structures and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Apr 2, 2019·52 cites·27 claims
- 0397US10256248B2Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Apr 9, 2019·42 cites·25 claims
- 0495US10811058B2Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 20, 2020·13 cites·20 claims
- 0595US10707228B2Three-dimensional memory device having bonding structures connected to bit lines and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jul 7, 2020·10 cites·13 claims
- 0686US10644015B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 5, 2020·3 cites·9 claims
- 0782US10847528B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 24, 2020·1 cites·20 claims
- 0880US10121522B1Sense circuit with two sense nodes for cascade sensingSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Nov 6, 2018·5 cites·20 claims
- 0973US12063780B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 1065US10120816B2Bad column management with data shuffle in pipelineSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Nov 6, 2018·2 cites·20 claims
- 1163US10825826B2Three-dimensional memory device having bonding structures connected to bit lines and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Nov 3, 2020·0 cites·7 claims
- 1260US11114439B2Multi-division 3D NAND memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 7, 2021·0 cites·20 claims
- 1348US2022165626A1Feed-forward run-to-run wafer production control system based on real-time virtual metrologyYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 1445US10790285B2Multi-division 3D NAND memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·14 claims
- 1540US10971199B2Microcontroller for non-volatile memory with combinational logicSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →