Inventor · disambiguated record

Yannan Liang

Also filed as: LIANG YANNAN

12 granted patents·14 pending applications·2 citations·filing 2018–2025

82Inventor score

Technology areasH10P C09G C09K C11D

Files withFUJIFILM ELECTRONIC MAT USA INC24 FUJIFILM ELECTRIC MAT U S A INC1 FUJIFILM PLANAR SOLUTIONS LLC1

Top patents by PatentIndex Score

26 records

0182US11414568B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Aug 16, 2022·1 cites·20 claims
0281US12319843B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
0377US10676646B2Chemical mechanical polishing slurry for cobalt applicationsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2018·Granted Jun 9, 2020·1 cites·17 claims
0477US2025277136A1Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
0575US2025333622A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2025·Application pending·0 cites
0671US12024650B2Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Jul 2, 2024·0 cites·21 claims
0771US2024141205A1Compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
0869US11851585B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Dec 26, 2023·0 cites·19 claims
0965US2023052829A1Compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
1063US11505718B2Barrier ruthenium chemical mechanical polishing slurryFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Nov 22, 2022·0 cites·25 claims
1162US12371589B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Jul 29, 2025·0 cites·21 claims
1262US11999876B2Bulk ruthenium chemical mechanical polishing compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Granted Jun 4, 2024·0 cites·10 claims
1362US2024327675A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2024·Application pending·0 cites
1458US2024174892A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
1557US2023193168A1Method of reducing defects on polished wafersFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
1656US2024034958A1Compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
1755US11034859B2Barrier ruthenium chemical mechanical polishing slurryFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Jun 15, 2021·0 cites·32 claims
1855US2023348754A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
1954US11279850B2Bulk ruthenium chemical mechanical polishing compositionFUJIFILM ELECTRONIC MAT USA INC·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
2054US2023136601A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
2153US11732157B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Granted Aug 22, 2023·0 cites·46 claims
2252US2023135325A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
2348US2022306899A1Polishing compositions and methods of using the sameFUJIFILM ELECTRONIC MAT USA INC·Filed 2022·Application pending·0 cites
2447US12398291B2Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2021·Granted Aug 26, 2025·0 cites·21 claims
2543US2021087431A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2020·Application pending·0 cites
2643US2022195242A1Chemical mechanical polishing compositions and methods of use thereofFUJIFILM ELECTRIC MAT U S A INC·Filed 2021·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →