Inventor · disambiguated record
Yangming Liu
Also filed as: LIU YANGMING
9 granted patents·6 pending applications·25 citations·filing 2017–2023
81Inventor score
Files withWESTERN DIGITAL TECH INC12SANDISK INFORMATION TECH SHANGHAI CO LTD2SANDISK TECHNOLOGIES LLC1
Top patents by PatentIndex Score
15 records- 0193US10854573B2Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etchSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Dec 1, 2020·14 cites·17 claims
- 0287US11393735B2Semiconductor device including reinforced corner supportsWESTERN DIGITAL TECH INC·Filed 2019·Granted Jul 19, 2022·5 cites·14 claims
- 0384US12033958B2Semiconductor device including a suspended reinforcing layer and method of manufacturing sameWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 9, 2024·1 cites·18 claims
- 0477US10236276B2Semiconductor device including vertically integrated groups of semiconductor packagesSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2017·Granted Mar 19, 2019·4 cites·17 claims
- 0563US11177239B2Semiconductor device including control switches to reduce pin capacitanceSANDISK INFORMATION TECH SHANGHAI CO LTD·Filed 2018·Granted Nov 16, 2021·1 cites·19 claims
- 0660US11978713B2Flip chip bump with multi-PI openingWESTERN DIGITAL TECH INC·Filed 2022·Granted May 7, 2024·0 cites·17 claims
- 0758US2025079400A1Unsingulated semiconductor packageWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0857US2024249950A1Semiconductor chip with varying thickness profileWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0957US2024304518A1Semiconductor chip having a high thermal liquid coolantWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1056US11961778B2Semiconductor device package having multi-layer molding compound and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 1152US11177242B2Semiconductor device including magnetic hold-down layerWESTERN DIGITAL TECH INC·Filed 2020·Granted Nov 16, 2021·0 cites·18 claims
- 1251US2023395446A1Mechanical support for a tall offset die stackWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1349US2023402361A1Semiconductor device including reinforcing blocksWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1448US2022406695A1Semiconductor device package having a ball grid array with multiple solder ball materialsWESTERN DIGITAL TECH INC·Filed 2021·Application pending·0 cites
- 1547US11985782B2Enclosure fitting for electronic deviceWESTERN DIGITAL TECH INC·Filed 2022·Granted May 14, 2024·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Yangming Liu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →