Inventor · disambiguated record
Yandong Mao
Also filed as: MAO YANDONG
7 granted patents·12 pending applications·59 citations·filing 2015–2024
79Inventor score
Top patents by PatentIndex Score
19 records- 0196US9990230B1Scheduling a notebook executionDATABRICKS INC·Filed 2016·Granted Jun 5, 2018·48 cites·19 claims
- 0282US9918416B2Electromagnetic interference shieldFINISAR CORP·Filed 2015·Granted Mar 13, 2018·8 cites·14 claims
- 0376US10551579B2Ferrule-to-lens latch mechanismFINISAR CORP·Filed 2018·Granted Feb 4, 2020·2 cites·20 claims
- 0474US2025383517A1Optical component with conductive trace, associated optical module, and associated methodST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0572US2025137841A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0665US2025138157A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 0764US12340256B1Reducing cluster start up timeDATABRICKS INC·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0862US12248818B1Reducing cluster start up timeDATABRICKS INC·Filed 2021·Granted Mar 11, 2025·0 cites·22 claims
- 0962US2025237744A1Attenuation wall to reduce optical noise in an optical ranging sensorST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1062US2025123193A1Vertical fatigue test device and method for dynamic submarine cable based on topology optimization design frameworkUNIV HARBIN ENG·Filed 2024·Application pending·0 cites
- 1162US2025138155A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1261US2025251493A1Aperture for reducing crosstalk, optical module having same, and associated methodST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1360US9995886B2Cable connectorFINISAR CORP·Filed 2016·Granted Jun 12, 2018·1 cites·20 claims
- 1460US2025138153A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1558US2025138156A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1657US2024421176A1Optical package comprising a cap and a support substrate connected togetherST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1757US2025138154A1Optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1856US10641977B2Optical subassembly with detachably-coupling holderFINISAR CORP·Filed 2019·Granted May 5, 2020·0 cites·20 claims
- 1952US2025287557A1Grounding of integrated external emi shield of an optical sensor moduleST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →