Inventor · disambiguated record
Yasuhiro Mizuguchi
Also filed as: MIZUGUCHI YASUHIRO
12 granted patents·8 pending applications·12 citations·filing 2012–2024
85Inventor score
Top patents by PatentIndex Score
20 records- 0189US2025054794A1Processing method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0285US12165894B2Processing method, method of manufacturing semiconductor, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0380US10651068B1Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 12, 2020·1 cites·12 claims
- 0480US10134587B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Nov 20, 2018·3 cites·18 claims
- 0579US11749550B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 0679US9875920B1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 23, 2018·3 cites·16 claims
- 0774US9244447B2Substrate processing apparatus, substrate processing method, non-transitory computer-readable recording medium, and substrate transfer methodHITACHI INT ELECTRIC INC·Filed 2012·Granted Jan 26, 2016·3 cites·11 claims
- 0872US11355372B2Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 7, 2022·0 cites·19 claims
- 0972US11342212B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 1070US10984991B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 1167US2022360822A1Substrate processing system, method of processing substrate, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1262US11422528B2Substrate processing system, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·0 cites·16 claims
- 1360US10290516B2Substrate processing apparatus, maintenance method, and maintenance programHITACHI INT ELECTRIC INC·Filed 2013·Granted May 14, 2019·1 cites·9 claims
- 1449US10930533B2Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 23, 2021·0 cites·9 claims
- 1548US2023326771A1Substrate processing apparatus, apparatus start-up method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1641US2019221460A1Method of manufacturing a semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 1741US2020216961A1Substrate processing apparatus, a non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 1837US2018350642A1Method of Manufacturing Semiconductor DeviceHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
- 1936US2013102159A1Substrate processing apparatus, substrate transfer method and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 2034US2017011974A1Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →