Inventor · disambiguated record
Yasutaka Nakashiba
Also filed as: NAKASHIBA YASUTAKA
282 granted patents·67 pending applications·1,907 citations·filing 1992–2025
99Inventor score
Files withRENESAS ELECTRONICS CORP176NEC CORP72NEC ELECTRONICS CORP60NAKASHIBA YASUTAKA21OHKUBO HIROAKI6
Top patents by PatentIndex Score
349 records- 0197US7550850B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Jun 23, 2009·51 cites·4 claims
- 0295US6690000B1Image sensorNEC CORP·Filed 1999·Granted Feb 10, 2004·222 cites·11 claims
- 0394US8378470B2Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·15 cites·20 claims
- 0494US8358009B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·15 cites·20 claims
- 0594US7030918B1Solid-state image pickup deviceNEC ELECTRONICS CORP·Filed 2000·Granted Apr 18, 2006·87 cites·25 claims
- 0693US7999386B2Semiconductor device including a guard ring surrounding an inductorRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 16, 2011·22 cites·20 claims
- 0792US11079540B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Aug 3, 2021·7 cites·14 claims
- 0891US9508662B2Optical semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·9 cites·9 claims
- 0990US10656442B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2018·Granted May 19, 2020·4 cites·16 claims
- 1090US8421188B2Semiconductor device including a guard ring surrounding an inductorUCHIDA SHINICHI·Filed 2011·Granted Apr 16, 2013·10 cites·19 claims
- 1189US8004062B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 23, 2011·12 cites·8 claims
- 1289US6872584B2Solid state image sensor and method for fabricating the sameNEC ELECTRONICS CORP·Filed 2002·Granted Mar 29, 2005·44 cites·12 claims
- 1389US6316814B1Solid imaging deviceNEC CORP·Filed 2000·Granted Nov 13, 2001·53 cites·10 claims
- 1487US11262500B2Semiconductor device and including an optical waveguide and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 1, 2022·3 cites·7 claims
- 1587US10921515B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 16, 2021·4 cites·16 claims
- 1687US8410493B2Semiconductor device which can transmit electrical signals between two circuitsNAKASHIBA YASUTAKA·Filed 2010·Granted Apr 2, 2013·7 cites·14 claims
- 1787US7619296B2Circuit board and semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Nov 17, 2009·12 cites·20 claims
- 1886US6081018ASolid state image sensorNEC CORP·Filed 1999·Granted Jun 27, 2000·80 cites·9 claims
- 1985US10895683B1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Jan 19, 2021·2 cites·15 claims
- 2085US9835882B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·4 cites·8 claims
- 2185US8106514B2Semiconductor device having an annular guard ringNAKASHIBA YASUTAKA·Filed 2009·Granted Jan 31, 2012·10 cites·7 claims
- 2284US6468826B1Solid state image sensor using an intermediate refractive index antireflection film and method for fabricating the sameNEC CORP·Filed 2000·Granted Oct 22, 2002·31 cites·20 claims
- 2383US10818591B2Semiconductor device with inductive coupling and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Oct 27, 2020·3 cites·18 claims
- 2483US8907460B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·6 cites·17 claims
- 2583US8686532B2Semiconductor device having an annular guard ringNAKASHIBA YASUTAKA·Filed 2011·Granted Apr 1, 2014·5 cites·10 claims
- 2683US7667279B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Feb 23, 2010·11 cites·12 claims
- 2783US7088195B2Voltage controlled oscillator having varactor and transistor regions underlying spiral conductorsNEC ELECTRONICS CORP·Filed 2004·Granted Aug 8, 2006·15 cites·22 claims
- 2883US6639293B2Solid-state imaging deviceNEC ELECTRONICS CORP·Filed 2001·Granted Oct 28, 2003·32 cites·11 claims
- 2983US6472698B1Solid state image sensor and method for fabricating the sameNEC CORP·Filed 2000·Granted Oct 29, 2002·29 cites·7 claims
- 3082US10886213B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Jan 5, 2021·1 cites·16 claims
- 3182US10818650B2Semiconductor module and method of manufacturing the same, and method of communication using the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 3282US10295743B2Optical semiconductor device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 21, 2019·4 cites·13 claims
- 3382US6841843B2Semiconductor integrated circuit deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jan 11, 2005·29 cites·9 claims
- 3482US6784015B2Solid state image sensor and method for fabricating the sameNEC ELECTRONICS CORP·Filed 2002·Granted Aug 31, 2004·27 cites·7 claims
- 3582US6060732ASolid state image sensor and method for fabricating the sameNEC CORP·Filed 1999·Granted May 9, 2000·52 cites·9 claims
- 3681US10895681B2Semiconductor module, manufacturing method thereof, and communication method using the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Jan 19, 2021·3 cites·19 claims
- 3781US8830694B2Circuit deviceKAWANO MASAYA·Filed 2011·Granted Sep 9, 2014·4 cites·22 claims
- 3881US6879234B2Semiconductor integrated circuitNEC ELECTRONICS CORP·Filed 2003·Granted Apr 12, 2005·29 cites·9 claims
- 3980US11630270B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Apr 18, 2023·1 cites·12 claims
- 4080US11435645B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 6, 2022·1 cites·10 claims
- 4180US8310025B2Semiconductor deviceNAKASHIBA YASUTAKA·Filed 2010·Granted Nov 13, 2012·4 cites·15 claims
- 4280US7973383B2Semiconductor integrated circuit device having a decoupling capacitorRENESAS ELECTRONICS CORP·Filed 2007·Granted Jul 5, 2011·7 cites·5 claims
- 4380US6407417B1Photoelectric conversion device and method of manufacturing the sameNEC CORP·Filed 2000·Granted Jun 18, 2002·26 cites·35 claims
- 4479US11183471B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Nov 23, 2021·2 cites·16 claims
- 4579US11002997B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted May 11, 2021·1 cites·18 claims
- 4678US8704334B2Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor deviceNAKASHIBA YASUTAKA·Filed 2011·Granted Apr 22, 2014·3 cites·12 claims
- 4778US7800668B2Solid state imaging device including a light receiving portion with a silicided surfaceNEC ELECTRONICS CORP·Filed 2006·Granted Sep 21, 2010·3 cites·14 claims
- 4878US7564113B2Solid state imaging deviceNEC ELECTRONICS CORP·Filed 2007·Granted Jul 21, 2009·4 cites·6 claims
- 4978US7545025B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Granted Jun 9, 2009·5 cites·11 claims
- 5078US2024304524A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 349 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →