Inventor · disambiguated record
Yaw S. Obeng
Also filed as: OBENG YAW · OBENG YAW S · OBENG YAW SAMUEL
43 granted patents·12 pending applications·981 citations·filing 1992–2021
98Inventor score
Files withLUCENT TECHNOLOGIES INC13PSILOQUEST INC12TEXAS INSTRUMENTS INC8PSILOQUEST5AGERE SYST GUARDIAN CORP4
Top patents by PatentIndex Score
55 records- 0195US6684704B1Measuring the surface properties of polishing pads using ultrasonic reflectancePSILOQUEST INC·Filed 2002·Granted Feb 3, 2004·62 cites·10 claims
- 0290US6048256AApparatus and method for continuous delivery and conditioning of a polishing slurryLUCENT TECHNOLOGIES INC·Filed 1999·Granted Apr 11, 2000·110 cites·23 claims
- 0389US6323131B1Passivated copper surfacesAGERE SYST GUARDIAN CORP·Filed 1998·Granted Nov 27, 2001·136 cites·9 claims
- 0489US5735963AMethod of polishingLUCENT TECHNOLOGIES INC·Filed 1996·Granted Apr 7, 1998·94 cites·6 claims
- 0588US8962097B1Surface properties of polymeric materials with nanoscale functional coatingYOKLEY EDWARD MAXWELL·Filed 2012·Granted Feb 24, 2015·10 cites·16 claims
- 0687US6439968B1Polishing pad having a water-repellant film theron and a method of manufacture thereforAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 27, 2002·30 cites·13 claims
- 0786US6706383B1Polishing pad support that improves polishing performance and longevityPSILOQUEST INC·Filed 2002·Granted Mar 16, 2004·34 cites·18 claims
- 0886US5417802AIntegrated circuit manufacturingAT & T CORP·Filed 1994·Granted May 23, 1995·90 cites·8 claims
- 0983US6083810AIntegrated circuit fabrication processLUCENT TECHNOLOGIES INC·Filed 1996·Granted Jul 4, 2000·73 cites·9 claims
- 1082US7059946B1Compacted polishing pads for improved chemical mechanical polishing longevityPSILOQUEST INC·Filed 2005·Granted Jun 13, 2006·10 cites·21 claims
- 1182US6596388B1Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications thereforPSILOQUEST·Filed 2001·Granted Jul 22, 2003·20 cites·16 claims
- 1277US6818301B2Thermal management with filled polymeric polishing pads and applications thereforPSILOQUEST INC·Filed 2002·Granted Nov 16, 2004·17 cites·21 claims
- 1377US6083838AMethod of planarizing a surface on a semiconductor waferLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jul 4, 2000·52 cites·18 claims
- 1476US5836805AMethod of forming planarized layers in an integrated circuitLUCENT TECHNOLOGIES INC·Filed 1996·Granted Nov 17, 1998·32 cites·4 claims
- 1574US6764574B1Polishing pad composition and method of usePSILOQUEST·Filed 2001·Granted Jul 20, 2004·20 cites·14 claims
- 1674US6579604B2Method of altering and preserving the surface properties of a polishing pad and specific applications thereforPSILOQUEST INC·Filed 2001·Granted Jun 17, 2003·14 cites·47 claims
- 1771US6838169B2Polishing pad resistant to delaminationPSILOQUEST INC·Filed 2003·Granted Jan 4, 2005·13 cites·17 claims
- 1869US6846225B2Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications thereforPSILOQUEST INC·Filed 2001·Granted Jan 25, 2005·10 cites·7 claims
- 1969US6688956B1Substrate polishing device and methodPSILOQUEST INC·Filed 2001·Granted Feb 10, 2004·12 cites·8 claims
- 2068US6150271ADifferential temperature control in chemical mechanical polishing processesLUCENT TECHNOLOGIES INC·Filed 1998·Granted Nov 21, 2000·34 cites·5 claims
- 2166US7700481B2Method for reliably removing excess metal during metal silicide formationTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 20, 2010·3 cites·11 claims
- 2265US2015103504A1Surface properties of polymeric materials with nanoscale functional coatingYOKLEY EDWARD MAXWELL·Filed 2014·Application pending·0 cites
- 2364US11519344B2System and method for operating an engine with reduced NOx emissionsOBENG YAW·Filed 2021·Granted Dec 6, 2022·0 cites·5 claims
- 2464US7943499B2FUSI integration method using SOG as a sacrificial planarization layerTEXAS INSTRUMENTS INC·Filed 2009·Granted May 17, 2011·1 cites·13 claims
- 2563US6162733AMethod for removing contaminants from integrated circuitsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Dec 19, 2000·27 cites·13 claims
- 2661US12276607B2System and method for monitoring ultraviolet radiation bioremediationGOVERNMENT OF THE US SECRETARY OF COMMERCE·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 2761US6821570B2Method for preparing a polymer for chemical mechanical polishingPSILOQUEST INC·Filed 2002·Granted Nov 23, 2004·7 cites·15 claims
- 2858US7732313B2FUSI integration method using SOG as a sacrificial planarization layerTEXAS INSTRUMENTS INC·Filed 2009·Granted Jun 8, 2010·0 cites·2 claims
- 2957US6575823B1Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereofPSILOQUEST INC·Filed 2002·Granted Jun 10, 2003·6 cites·31 claims
- 3057US6365503B1Method of improving electromigration in semiconductor device manufacturing processesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 2, 2002·6 cites·24 claims
- 3157US2009069790A1Surface properties of polymeric materials with nanoscale functional coatingYOKLEY EDWARD MAXWELL·Filed 2008·Application pending·0 cites
- 3256US6015333AMethod of forming planarized layers in an integrated circuitLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 18, 2000·13 cites·3 claims
- 3354US2019257254A1System And Method For Operating An Engine With Reduced NOx EmissionsOBENG YAW·Filed 2017·Application pending·0 cites
- 3452US7732312B2FUSI integration method using SOG as a sacrificial planarization layerTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 8, 2010·0 cites·15 claims
- 3551US6406609B1Method of fabricating an integrated circuitAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 18, 2002·4 cites·20 claims
- 3648US2005095865A1Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications thereforPSILO QUEST·Filed 2004·Application pending·0 cites
- 3747US7723199B2Method for cleaning post-etch noble metal residuesTEXAS INSTRUMENTS INC·Filed 2007·Granted May 25, 2010·0 cites·28 claims
- 3844US7670952B2Method of manufacturing metal silicide contactsTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 2, 2010·0 cites·6 claims
- 3944US2005266226A1Chemical mechanical polishing pad and method for selective metal and barrier polishingPSILOQUEST·Filed 2004·Application pending·0 cites
- 4043US5670376AMethodology for monitoring solvent qualityLUCENT TECHNOLOGIES INC·Filed 1994·Granted Sep 23, 1997·9 cites·5 claims
- 4143US5538921AIntegrated circuit fabricationAT & T CORP·Filed 1994·Granted Jul 23, 1996·12 cites·8 claims
- 4243US2005055885A1Polishing pad for chemical mechanical polishingPSILOQUEST·Filed 2004·Application pending·0 cites
- 4343US2007161246A1Process For Selectively Removing Dielectric Material in the Presence of Metal SilicideTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 4442US2008076076A1Rework methodology that preserves gate performanceTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 4541US2004110449A1Measuring the surface properties of polishing pads using ultrasonic reflectancePSILOQUEST INC·Filed 2003·Application pending·0 cites
- 4640US10152666B2Authentication article and process for making sameNATIONAL INSTITUTE OF STANDARDS AND TECH·Filed 2015·Granted Dec 11, 2018·0 cites·15 claims
- 4739US8273645B2Method to attain low defectivity fully silicided gatesVISOKAY MARK ROBERT·Filed 2009·Granted Sep 25, 2012·0 cites·19 claims
- 4839US2004132308A1Corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfacesPSILOQUEST INC·Filed 2003·Application pending·0 cites
- 4938US2005153631A1System and method for monitoring quality control of chemical mechanical polishing padsPSILOQUEST·Filed 2004·Application pending·0 cites
- 5037US2009020791A1Process method to fabricate cmos circuits with dual stress contact etch-stop liner layersYU SHAOFENG·Filed 2007·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →