Inventor · disambiguated record
Yaoyu Pang
Also filed as: PANG YAOYU
6 granted patents·1 pending application·7 citations·filing 2012–2022
73Inventor score
Top patents by PatentIndex Score
7 records- 0183US11373968B2Via structure for semiconductor diesCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2020·Granted Jun 28, 2022·2 cites·2 claims
- 0274US10468318B2Stiffener for providing uniformity in microelectronic packagesCISCO TECH INC·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 0370US9281269B2Integrated circuit package and method of manufactureTEXAS INSTRUMENTS INC·Filed 2012·Granted Mar 8, 2016·3 cites·10 claims
- 0467US12308331B2Via structure for semiconductor diesCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2022·Granted May 20, 2025·0 cites·7 claims
- 0555US10230212B1Method and apparatus to prevent laser kink failuresCISCO TECH INC·Filed 2017·Granted Mar 12, 2019·0 cites·19 claims
- 0655US2019207363A1Method and apparatus to prevent laser kink failuresCISCO TECH INC·Filed 2019·Application pending·0 cites
- 0753US11322465B2Metal layer patterning for minimizing mechanical stress in integrated circuit packagesCIRRUS LOGIC INT SEMICONDUCTOR LTD·Filed 2020·Granted May 3, 2022·0 cites·36 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →