Method and apparatus to prevent laser kink failures

Abstract

Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.

What is claimed is: 
     
         1 . A method comprising:
 observing a factor in a laser diode submount assembly lacking through vias in a submount of the laser diode submount assembly and laser diode submount assemblies with submounts including through vias with one or more fill materials; and   selecting, via a finite element analysis model of the factor, one or more properties of one or more through vias in one or more submounts configured to receive one or more laser diodes to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.   
     
     
         2 . The method of  claim 1 , further comprising:
 generating the model as a function of the amount of mismatch based on the factor.   
     
     
         3 . The method of  claim 2 , wherein the factor is an amount of bow of the laser diode submount assembly. 
     
     
         4 . The method of  claim 3 , wherein the one or more fill materials include varying through via properties. 
     
     
         5 . The method of  claim 1 , wherein reducing the amount of mismatch between the effective coefficient of thermal expansion of the one or more laser diodes and the effective coefficient of thermal expansion of the one or more submounts reduces an amount of bow in the one or more laser diodes caused by a process of cooling down the one or more laser diodes and the one or more submounts after bonding the one or more laser diodes onto the one or more submounts. 
     
     
         6 . The method of  claim 5 , wherein reducing the amount of bow in the one or more laser diodes reduces a chance of kink failure in the one or more laser diodes corresponding to distortions in gratings of the one or more laser diodes caused by the amount of bow in the one or more laser diodes. 
     
     
         7 . The method of  claim 1 , wherein the one or more properties of the one or more through vias include a number of the one or more through vias, dimensions of the one or more through vias, and/or a density of the one or more through vias in a volume of the one or more submounts. 
     
     
         8 . The method of  claim 7 , wherein the one or more properties of the one or more through vias include the one or more fill materials. 
     
     
         9 . The method of  claim 8 , wherein the one or more fill materials have a coefficient of thermal expansion greater than a coefficient of thermal expansion of a material of the one or more submounts to increase the effective coefficient of thermal expansion of the one or more submounts. 
     
     
         10 . The method of  claim 1 , wherein the one or more properties of the one or more through vias include positions of the one or more through vias in the one or more submounts relative to positions of the one or more laser diodes mounted to the one or more submounts. 
     
     
         11 . A method comprising:
 observing a factor in a laser diode submount assembly lacking through vias in a submount of the laser diode submount assembly and laser diode submount assemblies with submounts including through vias with one or more fill materials; and   developing a finite element analysis model of the factor in a laser diode as a function of an amount of mismatch between effective coefficients of thermal expansion of the laser diode and the submount based on the factor, the model enabling selection of one or more properties of one or more through vias in one or more submounts configured to receive one or more laser diodes to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.   
     
     
         12 . The method of  claim 11 , further comprising:
 selecting, via the model, one or more properties of one or more through vias in one or more submounts configured to receive one or more laser diodes to reduce the amount of mismatch.   
     
     
         13 . The method of  claim 12 , wherein the factor is an amount of bow of the laser diode submount assembly. 
     
     
         14 . The method of  claim 13 , wherein the one or more fill materials include varying through via properties. 
     
     
         15 . The method of  claim 11 , wherein reducing the amount of mismatch between the effective coefficient of thermal expansion of the one or more laser diodes and the effective coefficient of thermal expansion of the one or more submounts reduces an amount of bow in the one or more laser diodes caused by a process of cooling down the one or more laser diodes and the one or more submounts after bonding the one or more laser diodes onto the one or more submounts. 
     
     
         16 . The method of  claim 15 , wherein reducing the amount of bow in the one or more laser diodes reduces a chance of kink failure in the one or more laser diodes corresponding to distortions in gratings of the one or more laser diodes caused by the amount of bow in the one or more laser diodes. 
     
     
         17 . The method of  claim 11 , wherein the one or more properties of the one or more through vias include a number of the one or more through vias, dimensions of the one or more through vias, and/or a density of the one or more through vias in a volume of the one or more submounts. 
     
     
         18 . The method of  claim 17 , wherein the one or more properties of the one or more through vias include the one or more fill materials. 
     
     
         19 . The method of  claim 18 , wherein the one or more fill materials have a coefficient of thermal expansion greater than a coefficient of thermal expansion of a material of the one or more submounts to increase the effective coefficient of thermal expansion of the one or more submounts. 
     
     
         20 . The method of  claim 11 , wherein the one or more properties of the one or more through vias include positions of the one or more through vias in the one or more submounts relative to positions of the one or more laser diodes mounted to the one or more submounts.