Inventor · disambiguated record
Yan-Jia Peng
Also filed as: PENG YAN · PENG YAN-JIA
5 granted patents·3 citations·filing 2018–2021
64Inventor score
Top patents by PatentIndex Score
5 records- 0160US11234324B1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jan 25, 2022·0 cites·14 claims
- 0252US11488900B2Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 0343USD885486SWriting instrumentOFFICE DEPOT INC·Filed 2018·Granted May 26, 2020·3 cites·1 claims
- 0429USD883384SWriting instrumentOFFICE DEPOT INC·Filed 2018·Granted May 5, 2020·0 cites·1 claims
- 0523USD883383SWriting instrumentPENG YAN·Filed 2018·Granted May 5, 2020·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →