Inventor · disambiguated record
Yasa Sampurno
Also filed as: SAMPURNO YASA · SAMPURNO YASA ADI
4 granted patents·14 pending applications·26 citations·filing 2008–2022
72Inventor score
Top patents by PatentIndex Score
18 records- 0188US8845395B2Method and device for the injection of CMP slurryBORUCKI LEONARD JOHN·Filed 2012·Granted Sep 30, 2014·12 cites·15 claims
- 0283US9296088B2Method and device for the injection of CMP slurryBORUCKI LEONARD JOHN·Filed 2010·Granted Mar 29, 2016·7 cites·18 claims
- 0370US8197306B2Method and device for the injection of CMP slurryBORUCKI LEONARD·Filed 2008·Granted Jun 12, 2012·7 cites·21 claims
- 0459US12448545B2Silicon carbide (SIC) wafer polishing with slurry formulation and processARACA INC·Filed 2022·Granted Oct 21, 2025·0 cites·22 claims
- 0554US2024425723A1Pad-in-a-bottle chemical mechanical planarization polishing with cost-effective non-porous solid polishing padsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 0654US2025014911A1Pad-in-a-bottle and single platen chemical mechanical-planarization for back-end applicationsVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 0753US2024352279A1Pad-in-a-bottle (pib) technology for copper barrier slurriesVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
- 0848US2023287242A1Pad-in-a-bottle (pib) technology for copper and through-silicon via (tsv) chemical-mechanical planarization (cmp)VERSUM MAT US LLC·Filed 2021·Application pending·0 cites
- 0946US2010240283A1Method of Chemical Mechanical PolishingARACA INC·Filed 2009·Application pending·0 cites
- 1045US2025101261A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites
- 1144US2010159804A1Method of observing pattern evolution using variance and fourier transform spectra of friction forces in cmpARACA INC·Filed 2008·Application pending·0 cites
- 1243US2010186479A1Method for counting and characterizing aggressive diamonds in cmp diamond conditioner discsARACA INC·Filed 2009·Application pending·0 cites
- 1341US2008200032A1Polishing method of semiconductor substrateHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1441US2010216373A1Method for cmp uniformity controlARACA INC·Filed 2009·Application pending·0 cites
- 1538US2010203811A1Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmpARACA INC·Filed 2009·Application pending·0 cites
- 1638US2024379371A1Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the sameARACA INC·Filed 2022·Application pending·0 cites
- 1737US2011076924A1Method of determining the lubrication mechanism in cmpARACA INC·Filed 2009·Application pending·0 cites
- 1834US2011312182A1Method and apparatus for chemical-mechanical planarizationBORUCKI LEONARD JOHN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →