Inventor · disambiguated record
Yasuhiro Shinma
Also filed as: MURANO MITSUO · SHINMA YASUHIRO
24 granted patents·2 pending applications·485 citations·filing 1978–2011
96Inventor score
Top patents by PatentIndex Score
26 records- 0193US7285848B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2005·Granted Oct 23, 2007·19 cites·10 claims
- 0292US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0391US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 0491US6563207B2Split-mold and method for manufacturing semiconductor device by using the sameFUJITSU LTD·Filed 2002·Granted May 13, 2003·62 cites·6 claims
- 0587US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0682US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 0782US4240264AInterior unit of a split type air-conditioning apparatusTOKYO SHIBAURA ELECTRIC CO·Filed 1978·Granted Dec 23, 1980·47 cites·31 claims
- 0881US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 0977US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 1074US8174107B2Stacked semiconductor devices and a method for fabricating the sameSHINMA YASUHIRO·Filed 2008·Granted May 8, 2012·7 cites·13 claims
- 1171US5747874ASemiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1995·Granted May 5, 1998·37 cites·27 claims
- 1270US7696616B2Stacked type semiconductor device and method of fabricating stacked type semiconductor deviceSPANSION LLC·Filed 2006·Granted Apr 13, 2010·4 cites·9 claims
- 1369US7642637B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jan 5, 2010·2 cites·8 claims
- 1467US6022759AMethod for producing a semiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1998·Granted Feb 8, 2000·31 cites·8 claims
- 1566US7622067B2Apparatus and method for manufacturing a semiconductor deviceSPANSION LLC·Filed 2006·Granted Nov 24, 2009·3 cites·17 claims
- 1663US7489029B2Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor deviceSPANSION LLC·Filed 2005·Granted Feb 10, 2009·1 cites·8 claims
- 1762US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 1859US7851260B2Method for manufacturing a semiconductor deviceSPANSION LLC·Filed 2008·Granted Dec 14, 2010·1 cites·20 claims
- 1959US6444500B1Split-mold and method for manufacturing semiconductor device by using the sameFUJITSU LTD·Filed 2000·Granted Sep 3, 2002·8 cites·7 claims
- 2058US9368424B2Method of fabricating a semiconductor device used in a stacked-type semiconductor deviceSHINMA YASUHIRO·Filed 2005·Granted Jun 14, 2016·2 cites·10 claims
- 2156US9142440B2Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor deviceONODERA MASANORI·Filed 2008·Granted Sep 22, 2015·0 cites·18 claims
- 2256US6515347B1Wafer level semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2000·Granted Feb 4, 2003·7 cites·11 claims
- 2352US7846771B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2008·Granted Dec 7, 2010·0 cites·2 claims
- 2447US7414305B2Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devicesSPANSION LLC·Filed 2006·Granted Aug 19, 2008·0 cites·15 claims
- 2538US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 2630US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →