Inventor · disambiguated record
Yasutsugu Soeta
Also filed as: SOETA YASUTSUGU
3 granted patents·1 pending application·4 citations·filing 2004–2008
57Inventor score
Files withSHINETSU HANDOTAI KK4
Top patents by PatentIndex Score
4 records- 0161US7776719B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2007·Granted Aug 17, 2010·2 cites·5 claims
- 0245US7677957B2Polishing apparatus, method for providing and mounting a polishing pad in a polishing apparatus, and method for producing a substrate using the polishing apparatusSHINETSU HANDOTAI KK·Filed 2008·Granted Mar 16, 2010·0 cites·10 claims
- 0342US7591713B2Polishing pad, method for processing polishing pad, and method for producing substrate using itSHINETSU HANDOTAI KK·Filed 2004·Granted Sep 22, 2009·2 cites·11 claims
- 0431US2009117706A1Manufacturing Method of SOI Wafer and SOI Wafer Manufactured by This MethodSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →