Inventor · disambiguated record
Yasutoshi Tsubota
Also filed as: TSUBOTA YASUTOSHI
15 granted patents·15 pending applications·11 citations·filing 2012–2025
86Inventor score
Top patents by PatentIndex Score
30 records- 0188US12374527B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jul 29, 2025·0 cites·17 claims
- 0287US2025336646A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0380US10153153B2Method for removing adhering matter and dry etching methodCENTRAL GLASS CO LTD·Filed 2017·Granted Dec 11, 2018·3 cites·21 claims
- 0478US11664275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 30, 2023·1 cites·9 claims
- 0577US12154826B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 0676US2025022753A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0773US9236246B2Substrate processing apparatus and a method of manufacturing a semiconductor deviceHAMANO KATSUYOSHI·Filed 2012·Granted Jan 12, 2016·4 cites·6 claims
- 0868US11869748B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jan 9, 2024·0 cites·13 claims
- 0967US9147573B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Sep 29, 2015·2 cites·11 claims
- 1062US9518321B2Atomic layer deposition processing apparatus to reduce heat energy conductionHITACHI INT ELECTRIC INC·Filed 2014·Granted Dec 13, 2016·1 cites·4 claims
- 1156US2024243019A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1256US2024194476A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1355US12040161B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 1454US11908682B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1551US2023201889A1Cleaning method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1651US2023097581A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1751US2025210317A1Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1850US2022139760A1Substrate processing apparatus, susceptor cover, method of manufacturing semiconductor device and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1950US2023097621A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2048US2022301863A1Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2147US11081362B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·17 claims
- 2247US10796900B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·0 cites·15 claims
- 2347US9472424B2Substrate processing apparatus and a method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·0 cites·8 claims
- 2446US2022139675A1Method of Manufacturing Semiconductor Device, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2546US2021305045A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2643US11189483B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 2741US2016211151A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 2837US9974191B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 15, 2018·0 cites·11 claims
- 2934US2016155630A1Substrate processing apparatus, method for manufacturing semiconductor device, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 3033US2016079101A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →