Inventor · disambiguated record
Yasuyuki Yanase
Also filed as: YANASE YASUYUKI
20 granted patents·5 pending applications·63 citations·filing 2006–2018
92Inventor score
Top patents by PatentIndex Score
25 records- 0187US8309864B2Device mounting board and manufacturing method therefor, and semiconductor moduleKOBAYASHI HAJIME·Filed 2009·Granted Nov 13, 2012·21 cites·12 claims
- 0285US9362366B2Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor packagePANASONIC IP MAN CO LTD·Filed 2014·Granted Jun 7, 2016·8 cites·5 claims
- 0378US9130036B2Semiconductor device and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 8, 2015·4 cites·17 claims
- 0477US9307630B2Device mounting board, cell, and battery moduleSANYO ELECTRIC CO·Filed 2013·Granted Apr 5, 2016·2 cites·5 claims
- 0574US7855452B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Dec 21, 2010·5 cites·3 claims
- 0671US8338946B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceYANASE YASUYUKI·Filed 2010·Granted Dec 25, 2012·3 cites·5 claims
- 0769US10043877B2Metal-insulator-semiconductor field effect transistor (MISFET) device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 7, 2018·1 cites·8 claims
- 0869US8274148B2Semiconductor moduleYANASE YASUYUKI·Filed 2010·Granted Sep 25, 2012·4 cites·7 claims
- 0968US8373281B2Semiconductor module and portable apparatus provided with semiconductor moduleSANYO ELECTRIC CO·Filed 2009·Granted Feb 12, 2013·3 cites·13 claims
- 1067US8814029B2Metal bonding method and metal bonded structureSANYO ELECTRIC CO·Filed 2013·Granted Aug 26, 2014·2 cites·19 claims
- 1167US8288865B2Semiconductor module having semiconductor device mounted on device mounting substrateSUZUKI ATSUNOBU·Filed 2010·Granted Oct 16, 2012·4 cites·5 claims
- 1261US7989359B2Semiconductor module manufacturing method, semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Aug 2, 2011·2 cites·12 claims
- 1360US8847238B2Semiconductor device which can withstand high voltage or high current and method for fabricating the samePANASONIC CORP·Filed 2013·Granted Sep 30, 2014·1 cites·15 claims
- 1460US8497163B2Method for manufacturing a circuit deviceSANYO ELECTRIC CO·Filed 2012·Granted Jul 30, 2013·1 cites·19 claims
- 1557US8338853B2Substrate for forming light-emitting layer, light emitter and light-emitting substanceKIYAMA AKIRA·Filed 2006·Granted Dec 25, 2012·2 cites·12 claims
- 1653US10600880B2Semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·6 claims
- 1749US8129846B2Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable deviceYAMAMOTO TETSUYA·Filed 2008·Granted Mar 6, 2012·0 cites·7 claims
- 1848US8362611B2Semiconductor module, method for manufacturing semiconductor module, and portable deviceSANYO ELECTRIC CO·Filed 2008·Granted Jan 29, 2013·0 cites·17 claims
- 1945US8939348B2Metal bonded structure and metal bonding methodSANYO ELECTRIC CO·Filed 2013·Granted Jan 27, 2015·0 cites·22 claims
- 2045US8237258B2Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetweenSAITOU KOUICHI·Filed 2009·Granted Aug 7, 2012·0 cites·9 claims
- 2145US2010140797A1Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the moduleYANASE YASUYUKI·Filed 2009·Application pending·0 cites
- 2245US2008203557A1Semiconductor module and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2008·Application pending·0 cites
- 2343US2009183906A1Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the sameKOBAYASHI HAJIME·Filed 2008·Application pending·0 cites
- 2441US2013284794A1Metal bonding apparatusSANYO ELECTRIC CO·Filed 2013·Application pending·0 cites
- 2541US2013181344A1Semiconductor module, method for manufacturing the semiconductor module, and mobile apparatusSANYO ELECTRIC CO·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yasuyuki Yanase files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →